Electronics Forum | Wed Feb 21 14:10:36 EST 2007 | bobpan
The quad 1000 is best used for 0805 parts and larger. It is termed a chip shooter meaning 'for the most part' passives only. There is no optical alignment and it has mechanical centering using precisor pads. Fiducial finding is done with a beam and n
Electronics Forum | Wed Nov 23 07:08:31 EST 2005 | Al
Hi, I'm working as a process engineeer at a PCB manufacturing plant. I'm a part-time degree stundent, and for my final year project I have to evaluate and implement a selective soldering process. In order to do this, I need to find some good books
Industry News | 2016-01-17 11:04:34.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2016 on January 27th, scheduled from 5:00 pm to 7:00 pm at DfR Solutions, 9000 Virginia Manor Road, Suite 290, Beltsville, MD 20705. The focus of this chapter meeting will be “Test Plan Development – How to Do It!” presented by Dr. Gil Sharon, DfR Solutions.
Industry News | 2016-03-31 18:28:07.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2016 on April 12th, scheduled from 5:00 pm to 7:00 pm at DfR Solutions, 9000 Virginia Manor Road, Suite 290, Beltsville, MD 20705. The focus of this chapter meeting will be “Test Plan Development – How to Do It!” presented by Dr. Gil Sharon, DfR Solutions.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
Baja Bid | https://bajabid.com/product/2012-on-site-n-250-tgn-nitrogen-generator/
2012 On Site N-250-TGN Nitrogen Generator - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
Lewis & Clark | http://www.lewis-clark.com/product-tag/gc60/
: Genesis GC-60 4990D Description: Pick and Place Vintage: 2008 Details: Windows XP Operating System Software Version: 7.4.0.0 Lightning Feature OTHC (Narrow FOV) Camera on Beam 1
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