Electronics Forum: bga+aperture (Page 1 of 3)

Stencil design question.(BGA Apertures)

Electronics Forum | Mon Apr 03 09:58:49 EDT 2006 | PWH

Sounds a little like 2" O.D. pipe with 1" wall thickness.

Stencil design question.(BGA Apertures)

Electronics Forum | Tue Apr 04 11:51:44 EDT 2006 | dougs

10mil square apertures should be ok with your 4mil stencil.

BGA Aperture

Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev

Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo

BGA Aperture

Electronics Forum | Wed Jun 20 07:09:59 EDT 2007 | aj

Hi All, Just a quick question in relation to BGA Stencil Aperture Design - We currently use 1:1 ratio - are there any rules or benefits from over printing the PCB Pad ? Replies appreciated. aj...

stencil thickness for bga

Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef

Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]

Stencil design question.(BGA Apertures)

Electronics Forum | Mon Apr 03 07:46:21 EDT 2006 | cyber_wolf

I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I need to over print them, but how much without causing bridging issues ? Thanks, Sr.

Stencil design question.(BGA Apertures)

Electronics Forum | Tue Apr 04 14:00:48 EDT 2006 | russ

I have used a .013" square under these conditions. Limited run but all were good. 72 qty in 1 batch run

Stencil design question.(BGA Apertures)

Electronics Forum | Tue Apr 04 14:12:54 EDT 2006 | cyber_wolf

I did the apertures 1:1 using an Invar foil material. I will post and let you know how it works out. Thanks

BGA Aperture

Electronics Forum | Sat Jun 23 11:41:34 EDT 2007 | grantp

Hi, We use 1:1 for 1 mm BGA and it works fine. We used it at 4 thou laser cut stencils when we had a manual stencil printer, but have moved to 5 thou with the DEK and it works ok. We originally went to 4 thou because of paste release, but the DEK

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

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