New SMT Equipment: bga and balls and no and coating (1)

LED Pick and Place Machine ETA-M6

LED Pick and Place Machine ETA-M6

New Equipment | Pick & Place

LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic

Dongguan Intercontinental Technology Co., Ltd.

Electronics Forum: bga and balls and no and coating (2)

CSP and BGA soldering difference.

Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris

Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

Industry News: bga and balls and no and coating (8)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2018-06-26 20:35:35.0

The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Technical Library: bga and balls and no and coating (1)

Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect.

Technical Library | 2014-03-06 19:04:07.0

Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.

Christopher Associates Inc.

Videos: bga and balls and no and coating (1)

LED Pick and Place Machine

LED Pick and Place Machine

Videos

LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: bga and balls and no and coating (1)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Express Newsletter: bga and balls and no and coating (701)

SMTnet Express - April 16, 2015

SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State

SMTnet Express - April 5, 2018

SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced

Partner Websites: bga and balls and no and coating (161)

The Last Will And Testament of the BGA Void

Heller 公司 | https://hellerindustries.com.cn/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. Analysis of the thermal cycle results revealed that there was no statistically significant difference between the void and void-less solder joint populations for the 144 I/O BGA components (Figure 4). Figure 4

Heller 公司

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

& Coating Conference ICEHET (formerly ICSR) IWLPC (Wafer-Level) Medical Electronics Symposium Pan Pacific Certification Upcoming Expos All Expos Symposium on Counterfeit Parts and Materials-Tabletop Exhibition Ohio Expo Heartland Expo Houston Expo Juarez Expo

Surface Mount Technology Association (SMTA)


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Dual Lane Reflow Oven

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High Speed Precision In-Line SPI System - Mirtec MS-11
Large PCB Dispensing System

Outstanding liquid dispensing and UV curing, all within one platform, watch the video.