Electronics Forum: bga and ok and industries (Page 1 of 3)

BGA and Land Patterns

Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank

Flexi boards and uBGA

Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG

We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w

Re: BGA rework station and x-ray inspector

Electronics Forum | Sat Aug 15 07:56:16 EDT 1998 | Clyde F.

| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai PACE just came out with a new s

Flexi boards and uBGA

Electronics Forum | Fri Jul 07 03:27:31 EDT 2006 | dougs

Hi folks, thanks for all the tips. We have run our first batch of these flexi boards now. I had the PCB suppliers make me some 1.6mm FR4 carriers to lay the boards on to carry them through the process. (1 flat & 1 with cutouts for the second side)

Manual Pick and Place Manuals

Electronics Forum | Thu Sep 13 00:13:43 EDT 2012 | vikings

I recently purchased two used manual pick and place rotary carousel machines. They did not come with any literature and I've searched Google, this forum, and a few others with no luck. Does anybody know where I could find the owners/operator manuals

BGA ball and PCB pad

Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe

OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by

Re: BGA and Land Patterns

Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach

| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme

Re: BGA and Land Patterns

Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis

| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

Re: BGA Seminars and advice on repairs.

Electronics Forum | Thu Feb 25 13:17:21 EST 1999 | SMT-ASSY

Look up on the SMTnet directory for Training. Type in the search box "training" and then click on the search button. This should give you a list of all service provider which include training as part of their service to the industry. I am sure that

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