Industry Directory: bga and template (1)

I-Source Technical Services, Inc.

Industry Directory | Manufacturer

manufacture SMT stencils, SMT pallet and wave solder pallets, epoxy stencils, BGA rework systems,micro stencils, inspection templates. small percision metal parts.Electroform. SST Stencils. Machined parts.

New SMT Equipment: bga and template (790)

Refurbished YAMAHA YV100xg Pick and Place Machine

Refurbished YAMAHA YV100xg Pick and Place Machine

New Equipment | Pick & Place

Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type  L460 * W335 (MAX) -L50 * W50 (MIN)   L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

YAMAHA Second-Hand YV180XG Pick and Place Machine

YAMAHA Second-Hand YV180XG Pick and Place Machine

New Equipment | Pick & Place

YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Electronics Forum: bga and template (335)

6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer

Thank you Tsvetan Usunov

6 layer board and routing bga package

Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan

this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar

Used SMT Equipment: bga and template (11)

Yamaha Refurbished YV180XG Pick and Place Machine

Yamaha Refurbished YV180XG Pick and Place Machine

Used SMT Equipment | Chipshooters / Chip Mounters

Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X Pick and Place machine

Yamaha YV100X Pick and Place machine

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X  substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga and template (226)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

Parts & Supplies: bga and template (110)

Juki 2080 laser 8005674 and repair

Juki 2080 laser 8005674 and repair

Parts & Supplies | Pick and Place/Feeders

Supply JUKI 2080 laser 8005674 and repair Other juki parts: 40045126 HEAD L UP/DOWN SENSOR ASM 40045127 HEAD R UP/DOWN SENSOR ASM 40045132 HEAD L EJECTOR ASM 40045133 HEAD R EJECTOR ASM 40045135 FAN MOTOR(X MOTOR) ASM 40045136 LASER SENSOR CON

ZK Electronic Technology Co., Limited

Panasonic KME CM202/402/602 smt nozzle for pick and place machine

Panasonic KME CM202/402/602 smt nozzle for pick and place machine

Parts & Supplies | Chipshooters / Chip Mounters

KME CM202/402/602 smt nozzle for pick and place machine Part Number Alternative Description KXFX03DGA00 W1BCA CM202/402 NOZZLE TYPE: 110 KXFX0383A00  CM202/402 NOZZLE TYPE: 110 KXFW1BCAA00  CM202/402 NOZZLE TYPE: 110 KXFX03DHA00 W1BDA CM202/402

ZK Electronic Technology Co., Limited

Technical Library: bga and template (20)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Surface Finish Issues Affecting Solderability and Reliability

Technical Library | 2019-06-07 14:49:54.0

ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.

ACI Technologies, Inc.

Videos: bga and template (324)

Yamaha S20 Modular Pick and Place Machine

Videos

Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)

Dongguan Intercontinental Technology Co., Ltd.

3D  inspection machine

3D inspection machine

Videos

LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch

AATEC Ltd

Training Courses: bga and template (6)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga and template (3)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: BGA Reballing - Theory and Hands On

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,

Webinar: BGA Reballing - Theory and Hands On

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga and template (2)

Process Engineer and Technician

Career Center | , | 2001-05-16 15:58:28.0

Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning

Process and Product Support Engineers

Career Center | , New Jersey USA | Engineering

Several opportunities for skilled SMT Engineers and Product Support Engineers. Skilled in lean manufacturing and Kaizen. Skilled in working with BGA, Flip Chip and other related technologies. Skilled in new product introduction and line support acti

Circuit Search

Career Center - Resumes: bga and template (4)

SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Express Newsletter: bga and template (453)

Partner Websites: bga and template (3424)

BGA Rework Training and Certification – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training

BGA Rework Training and Certification – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc

Precision PCB Services, Inc

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins

Heller Industries Inc.


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