Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Oct 02 15:08:37 EDT 2002 | Eric
See Fiske first line. I'd bet You are bending or catching the assembly in the ICT. How many probes at 8OZ each? do you use on that ICT? 800 probes = 400lbs. See "Flexure induced failure of BGA solder joints" by Compaq Houston TX
Electronics Forum | Tue Mar 09 09:22:40 EST 2004 | Tobias
Hello, i'm searching for a way to remove bga's easy and cost effective. It doesn't matter if the PCB or adjacent assemblies are damaged. Thanks!
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri Sep 10 09:00:40 EDT 2004 | rlackey
Hi, It should get you at least a 1997 machine, but the age isn't as critical as the UPS level - you want at least 3.2.3. They are good machines & are well built, and at least comparable with any other second user machines (although not in the Fuji/
Electronics Forum | Thu Jan 20 20:22:16 EST 2000 | Sam Guilaume
We have run some experiments on double side BGA assembly. Our preliminary results show that complete overlap of top and bottom BGA's indicate fair results, even after reliabiltiy tests (vibrations, temperature cycles, HALT). I will be interested to h
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Thu Aug 13 03:41:30 EDT 2009 | robhs
At risk of raising a topic that has already been discussed at length, if that is the case then please point me in the right direction. We have a Lead-Free assembly that has BGA devices on both sides of the board. Any recommendations as to how we mig
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Mon Aug 17 19:37:25 EDT 2009 | hegemon
And of course the obvious, you'll want to be running that second side on the rail, and not the belt. Yeah, yeah, too obvious, I know... but don't say no one said so! 'Hege
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