Industry Directory: bga ball bridge (39)

Beau Tech

Beau Tech

Industry Directory | Manufacturer

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

New SMT Equipment: bga ball bridge (130)

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

Electronics Forum: bga ball bridge (1587)

BGA solder bridge

Electronics Forum | Thu Feb 24 23:11:51 EST 2011 | kemasta

HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect the pad on BGA was oxidie. Reject percentage quite low, only 5 out of 6000. But after the BGA re-ball, is work fine. Anyone have any idea to trobleshoot

BGA solder bridge - Adding Pictures

Electronics Forum | Mon Mar 21 17:36:44 EDT 2011 | davef

Kim: You could be correct. We had a batch of BGA that had a weird bridging pattern. Could not figure it out. So, we put the whole batch straight out of the 'box' bug-up on a hot plate and video recorded the balls as we took them through a thermal cy

Used SMT Equipment: bga ball bridge (52)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

Industry News: bga ball bridge (320)

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Parts & Supplies: bga ball bridge (264)

Yamaha YAMAHA YV100XG

Yamaha YAMAHA YV100XG

Parts & Supplies | Assembly Accessories

Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Fuji NXT-H01-H02-H02F-1.8MM-NOZZLE-AA8LW08

Fuji NXT-H01-H02-H02F-1.8MM-NOZZLE-AA8LW08

Parts & Supplies | Assembly Accessories

FUJI-NXT-H01-H02-H02F-1.8MM-NOZZLE-AA8LW08 H4006A HEAD,GEAR H4429M BEARING,BALL H4123A BEARING H4445A BEARING,MINIATURE H4451A BEARING,MINIATURE H4440A BEARING,MINIATURE S3033A SPROCKET S3034A SPROCKET S1022A CIR-CLIP W10022 WASHER N101

Qinyi Electronics Co.,Ltd

Technical Library: bga ball bridge (37)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

Videos: bga ball bridge (66)

SMTA International Exhibition 2015 - Electronics Manufacturing

SMTA International Exhibition 2015 - Electronics Manufacturing

Videos

SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri

Surface Mount Technology Association (SMTA)

Shuttle Star BGA Rework Station Features Side View Camera

Shuttle Star BGA Rework Station Features Side View Camera

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

Training Courses: bga ball bridge (15)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga ball bridge (5)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga ball bridge (4)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Senior Advanced Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering

Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi

Harris Corporation

Career Center - Resumes: bga ball bridge (10)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing

AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001

Express Newsletter: bga ball bridge (513)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall

Partner Websites: bga ball bridge (1199)

672219 - Center Rack Bridge

Heller Industries Inc. | https://hellerindustries.com/parts/672219/

672219 - Center Rack Bridge Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

Identifying and Correcting Solder Bridge Defects | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/

. Unlike solder ball defects , a solder bridge can be harder to see due to the fact that they may be invisible to the eye. Using a solder mask color with high visual contrast helps makes solder bridges more apparent

Imagineering, Inc.


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Thermal Transfer Materials.