Industry Directory: bga block (1)

SEMICON Sp. z o.o.  -  Poland

SEMICON Sp. z o.o. - Poland

Industry Directory | Manufacturer of Assembly Material / Manufacturer of Assembled PCBs / Repair / Rework / Tape and Reel Services / Consultant

EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018

New SMT Equipment: bga block (139)

3D SPI-6500 solder paste thickness gauge

3D SPI-6500 solder paste thickness gauge

New Equipment | Assembly Services

Detailed introduction of 3D spi-6500 solder paste thickness gauge  Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent

KingFei SMT Tech

Automatic solder paste printer GKg G9+

Automatic solder paste printer GKg G9+

New Equipment | Assembly Services

G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function

KingFei SMT Tech

Electronics Forum: bga block (17)

BGA Rework

Electronics Forum | Mon Dec 20 18:09:56 EST 2004 | BWET

Has anybody tried to use the new STENCILQUIK(TM) peel and stick BGA stencils that blocks solder flow and repairs damaged dogbone mask?

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto

We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top

Industry News: bga block (3)

Metcal Develops New Hand-Piece to Meet Higher Thermal Demands

Industry News | 2015-01-05 19:59:08.0

Metcal is pleased to introduce the new MX-HPDC dual cartridge hand-piece and MX-WHPDC work-stand. Designed to meet higher thermal demands, five new SMTC dual-shaft cartridge geometries also are available in two temperature series.


Data I/O FlashCORE III Programming Technology to Debut at Productronica

Industry News | 2009-12-07 18:08:56.0

Data I/O Corporation (NASDAQ: DAIO), the provider of manual and automated device programming solutions, today announced plans to debut its new FlashCORE III programming architecture at Productronica in Hall A2, Stand 329. This new technology will be at the core of every product to be highlighted at this key industry event, scheduled to take place 10th – 13th November at the Munich Trade Fair Center in Munich, Germany.

Data I/O Corporation

Parts & Supplies: bga block (122)

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Parts & Supplies | SMT Equipment

SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0 Specifications: Brand Name JUKI IMG-P IMAGE BOARD Part number E86107210A0 Model IMG-P Ensure Test in machine confirmation Guarantee 3 month u

KingFei SMT Tech



Parts & Supplies | Assembly Accessories

SMT MACHINE GENUINE SPARE PARTS JUKI FX-1 FX-1R FX-2 CONVEYOR TIMING BELT L166E921000 UNITTA 202-2GT JUKI Pats Specifications: Brand Name JUKI FX-1 FX-1R FX-2 CONVEYOR TIMING BELT Part Number L166E921000 Model Number UNITTA 202-2GT Ensure

KingFei SMT Tech

Technical Library: bga block (39)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.


Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.


Career Center - Resumes: bga block (3)

Sr.Engineer EMS

Career Center | Delhi, India | Maintenance,Production,Sales/Marketing,Technical Support

7 Years of experiance in SMT line

Equipment Engineer\B Tech (EC)\7.5+ Years Ex

Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support

CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR

Express Newsletter: bga block (450)

SMTnet Express - December 14, 2017

SMTnet Express, December 14, 2017, Subscribers: 30,979, Companies: 10,811, Users: 24,182 PCB Sourcing Using PCQR 2 Al Block, Naji Norder, Chris Joran; National Instruments In a global market, it is often difficult to determine the best PCB

Partner Websites: bga block (93)

bga block searches for Companies, Equipment, Machines, Suppliers & Information

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Online IPC Training & Certification

MSD Dry Cabinets
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.
decoating cleaning agent

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.