EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Industry News | 2015-01-05 19:59:08.0
Metcal is pleased to introduce the new MX-HPDC dual cartridge hand-piece and MX-WHPDC work-stand. Designed to meet higher thermal demands, five new SMTC dual-shaft cartridge geometries also are available in two temperature series.
Industry News | 2009-12-07 18:08:56.0
Data I/O Corporation (NASDAQ: DAIO), the provider of manual and automated device programming solutions, today announced plans to debut its new FlashCORE III programming architecture at Productronica in Hall A2, Stand 329. This new technology will be at the core of every product to be highlighted at this key industry event, scheduled to take place 10th – 13th November at the Munich Trade Fair Center in Munich, Germany.
SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0 Specifications: Brand Name JUKI IMG-P IMAGE BOARD Part number E86107210A0 Model IMG-P Ensure Test in machine confirmation Guarantee 3 month u
SMT MACHINE GENUINE SPARE PARTS JUKI FX-1 FX-1R FX-2 CONVEYOR TIMING BELT L166E921000 UNITTA 202-2GT JUKI Pats Specifications: Brand Name JUKI FX-1 FX-1R FX-2 CONVEYOR TIMING BELT Part Number L166E921000 Model Number UNITTA 202-2GT Ensure
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
SMTnet Express, December 14, 2017, Subscribers: 30,979, Companies: 10,811, Users: 24,182 PCB Sourcing Using PCQR 2 Al Block, Naji Norder, Chris Joran; National Instruments In a global market, it is often difficult to determine the best PCB
PCB Libraries Forum : Create BGA Footprint With Offset/Staggered Pins PCB Libraries Forum : Create BGA Footprint With Offset/Staggered Pins This is an XML content feed of
Siplace smt spare part 00345830 Plastic block Siemens/Siplace/ASM 3x8mm silver 00141098 feeder Siemens smt spare part Leave a Message We will call you back soon