Industry Directory: bga bottom (1)

Electronic Source Company

Electronic Source Company

Industry Directory |

Electronic Source Company (ESC) is an IS9100 Certified Contract Manufacture that provides service for the electronic industries. ESC provides turnkey, quick turns, production runs, and box build service to our customers.

New SMT Equipment: bga bottom (276)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

BGA Rework Station PRO-880+

BGA Rework Station PRO-880+

New Equipment | Rework & Repair Equipment

PRO-880+ is equipped with 100x camera, 4 thermocouple for real time profiling, 12 bottom heater and Panasonic servo moving system, can positioning, dismantle, pick&place, soldering automaticlly. Patently designed with movable upper/bottom heater,

1 CLICK SMT TECHNOLOGY CO., Limited

Electronics Forum: bga bottom (370)

bga warp

Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic

Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than

Double sided SMT, bottom side first or top side first ?

Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto

Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b

Used SMT Equipment: bga bottom (11)

SRT Summit 2100RD

SRT Summit 2100RD

Used SMT Equipment | Repair/Rework

● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an

Capital Equipment Exchange

Hakko FR1418-01 BGA Rework

Hakko FR1418-01 BGA Rework

Used SMT Equipment | Repair/Rework

Hakko FR1418-01 BGA Rework System 2004 Vintage (1) 222-529 pan and tilt mirror (retrofit) (1) optics calibration plate (2) 222-536 Long reach edge supports (1) 222-526 Bottom board rail support (1) Left or right rail support (9) Precision Manufactu

SMT Surplus, LLC

Industry News: bga bottom (80)

Europlacer to Debut iineo-II Placement System at APEX 2008

Industry News | 2008-03-04 12:05:25.0

APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.

EUROPLACER

Europlacer to Display iineo-II Placement System at IPC Midwest 2008

Industry News | 2008-09-14 15:09:42.0

APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.

EUROPLACER

Parts & Supplies: bga bottom (14)

Yamaha GLASS PLATE ADJUSTMENT KM0-M88C0-10X

Yamaha GLASS PLATE ADJUSTMENT KM0-M88C0-10X

Parts & Supplies | SMT Equipment

KM8-M1101-00X BASE(1/2, 2/2)            KM0-M1120-01X PLATE 10    1        KM8-M1112-00X PLATE 2    1        KM0-M1113-01X PLATE 3    1        KG7-M1114-00X PLATE 4    2        KG7-M1115-00X PLATE 5    1        KM0-M1141-00X MANUFOLD    2      

Qinyi Electronics Co.,Ltd

Yamaha KM5-M4580-022 KM5-M4580-02X KM5-M4580-03X IO CONVEYOR UNIT ASSY

Yamaha KM5-M4580-022 KM5-M4580-02X KM5-M4580-03X IO CONVEYOR UNIT ASSY

Parts & Supplies | Pick and Place/Feeders

KM5-M4580-022 KM5-M4580-02X KM5-M4580-03X IO CONVEYOR UNIT ASSY SMT equipment and accessories If you need anything You can send inquiry directly to email:smtdwx@163.com TEL: 86-0755-33160359 m/p:+86-15915451009 WhatsApp:+8615915451009 QQ:382

CNSMT CO.LTD

Technical Library: bga bottom (142)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: bga bottom (34)

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

BGA Rework Station PRO-880+

BGA Rework Station PRO-880+

Videos

PRO-880+ is equipped with 100x camera, 4 thermocouple for real time profiling, 12 bottom heater and Panasonic servo moving system, can positioning, dismantle, pick&place, soldering automaticlly. Patently designed with movable upper/bottom heater,

1 CLICK SMT TECHNOLOGY CO., Limited

Training Courses: bga bottom (1)

Non-Destructive BGA/Area Array Component Rework - Technical Workshop

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

PACE Worldwide

Events Calendar: bga bottom (3)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

Express Newsletter: bga bottom (505)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) INTRODUCTION This article is written to ensure everyone interested

SMTnet Express - May 24, 2018

SMTnet Express, May 24, 2018, Subscribers: 31,054, Companies: 10,942, Users: 24,751 Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units Udo Welzel, Marco Braun

Partner Websites: bga bottom (350)

BGA Rework Station - ML-5860 - QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/product-item/bga-rework-station/

upper heating of Forward and back position Rotating the handle 8 Bottom nozzle To focus the hot air Pull air from the BGA suitable location 9 Bottom heater up and down handle Adjust the lower nozzle

Qinyi Electronics Co.,Ltd

BGA Rework Stations,Infrared BGA & SMT Rework Station,Hot Air Rework – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/

$45,000.00 Nitrogen Capable for High Yield Lead Free BGA Rework Movable top and bottom gas heaters for large circuit boards. Places components from 1mm to 120mm

Precision PCB Services, Inc


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