ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2596-delaminations-in-substrate
BGA - MC to Substrate Delamination - Application Note 2596 Sample & Method In the image the echoes from the ultrasonic C-SAM transducer were gated on the interface between the molding compound and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=10
BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012 FLEX CIRCUIT DELAMINATIONS Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=10
Nordson SONOSCAN PQFP Die Cracks - Application Note 147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2641-3d-delaminations
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes 3D DELAMINATIONS 3D DELAMINATIONS PBGA 3D Substrate Delamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
1046 Multi Chip Module (MCM) Die Attach Defects 1066 Multi Chip Module (MCM) Direct Bond Copper Defects 2596 Plastic BGA2600PBGA MC to Substrate Delamination 2600 PBGA MC to Substrate Delamination 2602 PBGA Virtual Cross-Section2614Plastic BGA Ceramic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=10
: Lighting and LED PQFP DIE CRACKS Nordson SONOSCAN PQFP Die Cracks - Application Note 147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=10
147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/injection-molding?con=t&page=19
on the backside - Application Note 1053 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1011-pbga-delaminations
- Application Note 1011 Sample & Method The same plastic BGA packages shown in Note #1012 were imaged in reflection mode by C-SAM at 15 MHz
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0299-pbga-die-face-delaminations
Face Delaminations - Application Note 299 C-SAM Acoustic left, optical image middle, diagram right. Sample & Method A Plastic-packaged BGA was imaged
