High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.
Industry Directory | Manufacturer
Asia Pacific Circuits is one of Asia's leading Electronic Manufacturing Services companies, committed to providing high quality PCB and PCBA Contract Electronics Manufacturing Services.
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Test Equipment
Semiconductor SMT Offline X-ray X-8000 Products Introduction | I.C.T Group www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner Semiconductor SMT Offline X-ray X-8000 Introduce: X-8000 electronic semiconductor testing equipment can
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Wed Jun 29 16:25:51 EDT 2005 | mattkehoe
When discussing this with the customer he said that his vendor recommended a hard gold plating finish on the board due to the BGA. I said "hard gold"??? And he said yes, hard gold. Turns out the boards were plated with hard gold, not ENIG. Thank
Used SMT Equipment | X-Ray Inspection
Glenbrook RTX-113HV X-Ray Inspection System Vintage: June 2001 Tube Hours: Approx 1000 Calibrated through 2014, used approx 3-5 hours since 2014 High Voltage X-Ray for better results 80kV GTI-5000 Image Processor Motorized X-Y Sony Therma
Used SMT Equipment | Pick and Place/Feeders
AUCTION ITEM: MARCH 20th to 21st Check www.xlineassets.com for details. Other equipment available in same auction: • Assembleon MG-8 Placement System (2007) • (2) Assembleon Topax XII Placement Systems (2003) • (2) Assembleon Emerald XII Plac
Industry News | 2023-08-03 11:31:37.0
PCB/BGA Rework and Training Facility now in Plano, Texas
Industry News | 2019-03-14 11:28:14.0
Precision PCB Services, Inc. Opens New Texas Location
Parts & Supplies | Circuit Board Assembly Products
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA
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Parts & Supplies | Pick and Place/Feeders
Used juki 750 SUB-CPU CARD available for sale. SHENZHEN GREEN TECHNOLOGY Company was found in 2003.we are specialized in the field of Industrial PC boards and Electronic controls Repair,and supply SMT/AI spare parts. Here are some of the item
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2014-11-06 16:43:24.0
This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
SolderTip #46: Open Connections Found on BGA Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
