Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Tue Mar 09 22:06:24 EST 2004 | Ken
Two words that will send shivers down any self-respecting rework professionals spine: HEAT GUN Not affiliated with black and decker or vidal sasoon hair dryers.
Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth
1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper
Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs
That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o
Electronics Forum | Tue Feb 24 17:16:11 EST 2015 | grauen06
I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but
Electronics Forum | Thu Feb 26 12:24:02 EST 2015 | emeto
The best test will be to X-ray BGA under 3-D X-ray. About the techniques used for BGA repair you can probably take closer look to some BGA repair stations, even though I have seen it done with hot air gun in the early days.
Electronics Forum | Mon Mar 30 12:52:45 EDT 2015 | grauen06
The PCB is in a housing when it is returned from the field and it takes 1.5 hours to remove the PCB from the housing so we are looking for a way to rework the BGA without removing it from the housing. Hence, top-side rework only.
