Removable BGA Heatsinks With Revolutionary �EZ Snap� Clip - Easily Installed - Eliminates complex assemblies - Omni directional airflow to maximize heat dissipation - �Round Pin� Heatsinks out perform Crosscuts and Plate Fin Heatsinks in most appli
The MX-3600 is an In-line X-RAY inspection system with the new MIPS-inspection platform of MatriX Transmission X-RAY technology is combined with the patented Slice-Filter Technology (SFT) for double-sided or overlaying applications. The high speed MX
Automated inspection system designed for high-speed final inspection of printed circuit boards and complete assemblies. The X2.5L is based on the well-established MatriX X2.5 system series. It is configured with a new generation of TDI X-ray cameras
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
Automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of
The XT-6 is a highly flexible X-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. This technology is es
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
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