Electronics Forum | Wed Aug 24 10:18:19 EDT 2005 | james
Well that Genius did it on this BGA. It does have a heatsink and absorbs alot of heat. It just stinks because the BGA cost over 1000 and I really can not scrap a board. But that first profile does not look correct for this board with the BGA esp.
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Electronics Forum | Wed Jul 09 15:54:51 EDT 2003 | Louis
I need advice from someone who has already soldered this part or similar fine-pitch BGA with metal heatsink on top Should I solder it in the oven or it's better with a rework station (IR 550A Ersascope) Thanks All
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Wed May 23 12:02:46 EDT 2012 | aj
Hi, You can go a long to answering that question yourself - what do you need to see? If you are lookig for the normal stuff like bridging, opens and voids you dont need anywhere near 130-160kv. I have just completed the same excercise and we have s
Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty
Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Tue Aug 30 09:33:55 EDT 2005 | Slaine
whats the actual failure mechanisum your seeing which balls on the BGAs? my bet is its the ones on the corners, this is mainly due the the large heatsink on the top of the BGA when it starts to get hot it acts as a bi-metalic strip and lifts the corn
