Electronics Forum | Tue Nov 18 14:33:45 EST 2008 | stepheniii
Do you mean BGA reballing? If so, then not with a hot air gun.
Electronics Forum | Mon Nov 17 07:11:27 EST 2008 | vithalchidrawar
Dear all, I have only hot air gun. Can I do the BGA soldering & BGA ball formation also. Pl suggest vithal
Electronics Forum | Tue Sep 11 11:40:17 EDT 2007 | shing
Please help to answer me the followings questions: 1. The optimum temperature for IC reapir (TSOP & BGA), since many IC found defective after reapir by hot air gun 2. How many time does a IC(TSOP & BGA) can pass throught the IR Reflow without defecti
Electronics Forum | Sun Nov 23 10:03:19 EST 2008 | tsvetan
Hi, yes, you can, but it will be subject to long learn curve where i live there are hundreds of GSM repair shops which do BGA rework and replacement with $50 hot air guns only, but i guess they had lot of BGAs damaged before they have learned how to
Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn
I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I
Electronics Forum | Thu Feb 26 12:24:02 EST 2015 | emeto
The best test will be to X-ray BGA under 3-D X-ray. About the techniques used for BGA repair you can probably take closer look to some BGA repair stations, even though I have seen it done with hot air gun in the early days.
Electronics Forum | Mon Dec 07 16:40:37 EST 2009 | jkomets
I have a number of computer parts with faulty VRAM. I have two high-end video cards and a laptop motherboard, each worth over US$100, and some other parts worth less. They all exhibit symptoms typical of faulty VRAM; that is, they display multicolore
Electronics Forum | Mon Apr 25 12:19:21 EDT 2005 | siverts
Hi all, We produced a RoHS (lead-free) prototype order recently, and there was some components that we needed to replace on a couple of PCBA's. We found it very hard to do this even with the new solder iron. The components was just small RoHS SOIC's
Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1
It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-
Electronics Forum | Fri Dec 12 14:20:44 EST 2014 | emeto
there are several ways: 1. Manual method- Remove the part using hot air gun, clean the pads, make a small stencil to re-ball the BGA and it is ready for placement. 2. Improved method - Use equipment dedicated for BGA rework 3. No hassle method - Giv
