Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Industry Directory | Manufacturer
pcb construction@testing using surface mount and through hole components.
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2008-08-11 23:45:48.0
OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Parts & Supplies | SMT Equipment
SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0 Specifications: Brand Name JUKI IMG-P IMAGE BOARD Part number E86107210A0 Model IMG-P Ensure Test in machine confirmation Guarantee 3 month u
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00358497-02 Cable HS50, Comp. Illum.Control, modular 00358644-02 KIT ELECTRIC HEAD CRASH SENSOR 00358653S04 Lifting Table Single transport 00358654S04 Lifting Table Dual transport 0035867
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-pad-repair
. We repair Surface Mount Pads, BGA pads, Gold Finger Contacts and other circuitry including Circuit Modification. Price may vary depending on quantity, type of pad and degree of damage
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
SolderTip #46: Open Connections Found on BGA Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
