Electronics Forum: bga not collapse (145)

BGA collapse during reflow

Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Industry News: bga not collapse (2)

TopLine Offers Bonding Wire, CCGA, Solutions at Productronica 2023

Industry News | 2023-10-23 09:52:43.0

TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.

TopLine Dummy Components

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Express Newsletter: bga not collapse (452)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part

Partner Websites: bga not collapse (1493)

BGA Rework Station | Qinyi Electronics Co.,Ltd

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/ml-g200-bga-rework-station-221923?page=61&order=list_price+desc

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Qinyi Electronics Co.,Ltd

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

+ cycles Investigation Conclusion:  Overall void density on BGA component was not high  Solder crack path typically found at solder joint / BGA package interface 165  Planar (flat

Heller Industries Inc.


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