Industry Directory: bga pad size too large (1)

AGILITY mfg

Industry Directory | Consultant / Service Provider / Manufacturer

A Contract Manufacturing company specializing in Printed Circuit Board Assembly, Quick Turn Prototype Services, and Direct Fulfillment.

New SMT Equipment: bga pad size too large (37)

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

Optical aligment bga rework station WDS-700 automatic mobile phone repair machine

Optical aligment bga rework station WDS-700 automatic mobile phone repair machine

New Equipment | Rework & Repair Equipment

Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size  Optical aligment bga rework station WDS-700 automatic mobile phone repair machine for galaxy note 4 emmc

Shenzhen Wisdomshow Technology Co,Ltd.

Electronics Forum: bga pad size too large (72)

BGA pad size too large??

Electronics Forum | Wed Sep 07 00:28:04 EDT 2011 | woodsmt

I have identified a Board design issue and having trouble convincing others of my findings. I have a BGA (Sn63 balls, +1500 IO, 0.6mm ball, 1mm pitch, with heat spreader plate)that has a high incidence of solder shorting on the corners. The board i

BGA pad size

Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef

Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn

Industry News: bga pad size too large (8)

BGA TEST BOARD

Industry News | 2003-06-20 18:28:55.0

Makes continuity and placement evaluation a snap.

Practical Components, Inc.

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Parts & Supplies: bga pad size too large (2)

Fuji QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine

Fuji QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: FUJI Model: ADBPN-8143 Part Name: Nozzle Size: 3.7M Lead Time: Within 3days Machine Model: QP341 SMT Machine QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine​ Description: Model:

KingFei SMT Tech

JOT bBGA Rework Station FG-A4650

JOT bBGA Rework Station FG-A4650

Parts & Supplies | Repair/Rework

. This machine adopts industrial computer control, full automatic vision alignment system can acquire BGA and the PCB image through the CCD camera and collect them on the image positioning processing system, calculate the offset position and angle th

Goodluck Electronic Equipment Co.,Ltd

Videos: bga pad size too large (4)

DH-A2 automatic BGA rework station for computer and mobile phone repairing

DH-A2 automatic BGA rework station for computer and mobile phone repairing

Videos

Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si

Shenzhen Dinghua Technology Development Co., Ltd.

FOR LARGE PCBS - The PDR IR-E6 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies.

FOR LARGE PCBS - The PDR IR-E6 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies.

Videos

FOR LARGE PCBS - The PDR IR-E6 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies. The IR-E6 has a very large capacity, handling PCBs up to 26" (620mm) wi

PDR-America

Express Newsletter: bga pad size too large (779)

Partner Websites: bga pad size too large (212)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

+ cycles Investigation Conclusion:  Typical void size was 2-3% diameter, overall range was 0-24% diameter  Voids were typically found at solder joint / BGA package interface

Heller Industries Inc.

Solder Ball Defects-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print

  • Excessive solder paste slump after printing   • Sphere size of solder paste too large for pitch components being soldered   • Excessive moisture absorbed by solder paste


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