New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Desktop covenyor Reflow Oven R350 from prototyping to full production. Desktop covenyor Reflow Oven R350 from prototyping to full production. Product Description Introduction: R350 mini reflow oven R350 is the first inline lead free reflow oven
Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2012-02-23 14:43:13.0
IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer: 40001570 CPCI BOARD ASM 40001589 LIGHT CTRL BOARD PANEL 40001590 BASE FEEDER POWER BOARD PANEL ASM 40001591 SAFETY POWER BOA
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer: 40001570 CPCI BOARD ASM 40001589 LIGHT CTRL BOARD PANEL 40001590 BASE FEEDER POWER BOARD PANEL ASM 40001591 SAFETY POWER BOA
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Technical Library | 2014-01-30 18:08:04.0
As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/side-view-bga-camera
. Allows you to view when the solder balls reflow during installation. Also allows you to confirm alignment when BGA, (Ball Grid Array) component is placed on the PCB
