Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale
New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi
A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.
Electronics Forum | Mon Jan 12 20:43:39 EST 2004 | Al
who has the step by step how to reball a Ceramic BGA this is a CBGA 50 mil pitch 29 by 29 mm size
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000(grain per hour) Japan's YAMAHA YV100II SMT machine: The patch speed: 0
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
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E2306725000 TIMING BELT (YA) E2305721AA0 YM BRACKET R ASM.(TS4513N1820E200) E2305725000 YM BRACKET E23057250A0 YM BRACKET ASM.(AC800W) E2305760000 ROTARY SHAFT E2306715000 ETP BUSH E23067160A0 Y CARRIER BASE ASM E2306721000 TIMING BELT YA E2
Parts & Supplies | Pick and Place/Feeders
NXT nozzle NXT-H01-7.0G (AA07300/AA07310) Spare Name: AA07300 AA07310 NXT-H01-7.0G Specifications Model: NXT NOZZLE Head H01 Dia 7.0G. FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800 F
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
Demo on how to reball a BGA component using a universal reball fixture.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
| http://www.feedersupplier.com/sale-24886815-goldland-gl-a5-bga-rework-station-large-scale-optical-alignment.html
: For SMT Production Line Application: In Common Use High Light: Goldland GL-A5 BGA Rework Station , Optical Alignment BGA Rework Station , Large Scale BGA Reballing Station Product Description BGA rework station goldland GL-A5 large-scale optical alignment BGA rework station
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
equipment manufacturers semiconductor fabrication semiconductor manufacturing semiconductor yield semiconductor yield analysis uf3800 underfill underfill adhesive underfill bga underfill chip underfill
