Industry Directory | Manufacturer
Lixi manufactures high resolution low intensity x-ray systems for use in the printed circuit board (PCB)industry. These systems offer an economical, safe, and reliable system for the inspection of BGA's
Industry Directory | Consultant / Service Provider / Manufacturer
High Reliability AS9100 Aerospace Electronic Contract Manufacturer PCB design, engineering contract assembly of rapid prototypes to volume production. Class III, 3D BGA X-Ray, Conformal Coatings, Environmental Screening
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Rework & Repair Equipment
Laptop bga rework station bga repair machine ipad board repair Features: 1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled; 2. Movable heating head,which can be moved freely horizontally;
Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff
On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L
Used SMT Equipment | Pick and Place/Feeders
CP45FV NEO Popular CP45FV NEO. Highly Flexible, user friendly machine and highly reliable. Full vision with 6 placement heads, each with individual illumination allowing 6 totally different components to be aligned on the fly. Upward looking
Used SMT Equipment | Pick and Place/Feeders
Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed ：18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co
Industry News | 2017-04-03 15:02:09.0
MIRTEC today announced they are participating in the upcoming What's New in Electronics Live! event. They will exhibit in booth #8. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Parts & Supplies | Pick and Place/Feeders
Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2023-11-25 07:46:13.0
In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
Featured Article Return to Front Page Reliability Ass
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Solder Joint Void Classifications [3] Figure 2a. Locations within a BGA solder joint where voids are expected to have a greater risk on joint reliability [3]. mailto:richard.coyle@nokia-bell-labs.com mailto:david.hillman
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
“The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability” [5] Investigation Specifics: 225 I/O Plastic BGA, daisy chained, 0.762mm (30 mil
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