US based manufacturer of burn-in and test sockets. Wide range of BGA, QFP, QFN, PLCC and other sockets. All products made in the USA.
Industry Directory | Manufacturer's Representative
MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Used SMT Equipment | Adhesive Dispensers
YAMAHA placement machine YV100X type substrate size: 1, M-Type: L460 * W335 ~ L50xW50mm / t = 0.4 ~ 3.0mm 2, L-Type: L460 * W440 ~ L50xW50mm / t = 0.4 ~ 3.0mm 3, ※ATS20A use: L460*W250～L50xW50mm Second, YAMAHA placement machine YV100X productio
Industry News | 2015-10-21 17:54:32.0
Count On Tools will display its new QWIKTRAY system in the AdoptSMT Booth, Hall A3 Booth 181, at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exists. As a result, customers no longer have to place these components by hand.
Industry News | 2017-07-26 12:23:26.0
Count On Tools is pleased to announce that it has reduced pricing on the QWIKTRAY system from $699 to $499 each, with even lower prices on higher volumes. COT can provide these significant cost savings due to further development of the manufacturing process and reduced materials costs. The new pricing took effect July 14 2017.
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE SPARE PARTS JUKI FX-1 FX-1R TWO-PHASW STEPING MOTOR L900E321000 103H7823-17XE42 JUKI Pats Specifications: Brand Name JUKI FX-1 FX-1R TWO-PHASW STEPING MOTOR Part Number L900E321000 Model Number 103H7823-17XE42 Ensure Te
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
Technical Library | 2019-01-30 21:20:47.0
Due to the arrayed nature of the Computed Tomography (CT) Detector, high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically, the detector module sensor element, hereby known as the Multi-chip module (MCM), has a 544 position BGA area array pattern that requires precise test stimulation. A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. (...) This paper and presentation will focus on the socket design challenges and also key learnings from the design that can be applied to general test systems, including reliability testing. The secondary focus will be on the overall data collection and graphical user interface for the test equipment.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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Career Center | NOIDA, UP India | Production,Research and Development,Technical Support
• 17+ years of experience as Programmer/Analyst/Technical Lead/Project Lead/Technical Manager/Technical Architect • 9+ years of experience in PCB Automation Assembly Process MES (Manufacturing Execution Systems). • SMT (Surface Mounting Technolog
SMTnet Express, January 31, 2019, Subscribers: 31,643, Companies: 10,701, Users: 25,678 Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor Credits: General Electric Due to the arrayed nature
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Alan Donaldson and Raiyomand Aspandiar, Intel Corporation "Hot Air Lead-free Rework of BGA Packages & Sockets" 2003: Dave Nelson and Hector Pallavicini, Raytheon Systems Company "Manufacturing and Reliability of Pb-free and Mixed System Assemblies (SnPb/Pb-Free
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