Industry Directory: bga solder joint fillets (6)

Tianjin Reains Technologies Co., Ltd

Industry Directory | Adhesives / Dispensing

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

Vision SMT Kft

Industry Directory | Contract Manufacturer

Vision SMT Kft is Contract Manufacturer,offers a range of electronic manufacturing services (EMS)including BGA components. Prototype manufacturing, low and high quantity serial production.

New SMT Equipment: bga solder joint fillets (113)

Qualitek Solder Powder

New Equipment | Solder Materials

Solder powders are the key component of all solder pastes. Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing, compone

Qualitek International, Inc.

DJ-9000 DispenseJet Jet Technology

DJ-9000 DispenseJet Jet Technology

New Equipment | Dispensing

Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on

Nordson ASYMTEK

Electronics Forum: bga solder joint fillets (734)

fillets on fine pitch parts/poor wetting

Electronics Forum | Wed Nov 06 19:03:33 EST 2002 | broncos

If you are certain that reflow process is good, I would suggest starting checking the following: 1. Check to see if leads / pads are contaminated or oxidized. However, this usually results poor solder quality throughout the board. 2. Check the amou

Post reflow solder joint inspection

Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc

About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very

Used SMT Equipment: bga solder joint fillets (7)

CR Tech CRX2000

CR Tech CRX2000

Used SMT Equipment | X-Ray Inspection

CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold

1st Place Machinery Inc.

Nicolet NXR-1500

Nicolet NXR-1500

Used SMT Equipment | X-Ray Inspection

Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick

1st Place Machinery Inc.

Industry News: bga solder joint fillets (203)

CALTRONICS Purchases MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Machine at SMTAI 2016

Industry News | 2016-11-01 19:52:12.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.

MIRTEC Corporation

MIRTEC Corp. to Highlight the MV-7L In-Line AOI System at SMTA International 2008

Industry News | 2008-08-11 23:45:48.0

OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.

MIRTEC Corporation

Parts & Supplies: bga solder joint fillets (1)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: bga solder joint fillets (226)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Videos: bga solder joint fillets (35)

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

MIRTEC MV-7 In-Line AOI Series Movie

MIRTEC MV-7 In-Line AOI Series Movie

Videos

MIRTEC MV-7 Series In-Line Automated Optical Inspection Machine - AOI MIRTEC USA, MIRTEC, MIRTEC Corp

MIRTEC Corporation

Training Courses: bga solder joint fillets (3)

IPC 7095 BGA Rework Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: bga solder joint fillets (5)

Role of Bismuth in Lead-free Electronics - SMTA Webtorial

Events Calendar | Wed Mar 14 00:00:00 EDT 2018 - Wed Mar 14 00:00:00 EDT 2018 | ,

Role of Bismuth in Lead-free Electronics - SMTA Webtorial

Surface Mount Technology Association (SMTA)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bga solder joint fillets (3)

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing

AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control

AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS

Express Newsletter: bga solder joint fillets (903)

Partner Websites: bga solder joint fillets (224)

Crystal, Side & Heel fillets - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/crystal-side-heel-fillets_topic1362.html

: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 4518 Post Options Post Reply Quote Tom H Report Post    Thanks(0)    Quote    Reply Topic: Crystal, Side & Heel fillets     Posted: 13 Jun 2014 at 1:30pm Crystals use the same lead form solder joint rules as the Aluminum Electrolytic Capacitor

PCB Libraries, Inc.

EMPF PP0007 - Automated Inspection/Solder Joint Inspection (Sept 1994)

| https://store.aciusa.org/EMPF-PP0007-Automated-InspectionSolder-Joint-Inspection-Sept-1994-P92.aspx

) A Direct Chip Attach BGA (Oct 1994) Price: $0.00 + Add to Cart Categories There are no subcategories. Share Tweet Pin It Top Sellers EMPF RB0009 - Solder Joint Volume Calculation Using a Spreadsheet (June 1993) 400027 Price: $0.00


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