Industry News: bga solder joints (Page 1 of 196)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

HELLER Shanghai 2023 New Plant - Grand Opening

Industry News | 2023-04-19 17:43:01.0

As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.

Heller Industries Inc.

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

MIRTEC Corp. to Highlight the MV-7L In-Line AOI System at SMTA International 2008

Industry News | 2008-08-11 23:45:48.0

OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.

MIRTEC Corp

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

New EMS, Lightspeed Manufacturing, Opens for Business

Industry News | 2003-03-11 08:16:17.0

Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.

SMTnet

MIRTEC Corp. Wins a 2008 NPI Award for its MV-7L In-Line AOI System

Industry News | 2008-04-07 22:15:22.0

OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

MIRTEC Corp

MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine

Industry News | 2008-07-19 15:38:37.0

OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

MIRTEC Corp

MIRTEC TO PREMIER ITS TECHNOLOGICALLY ADVANCED AUTOMATED OPTICAL INSPECTION EQUIPMENT AT SMTAI Orlando 2012

Industry News | 2012-09-13 10:44:36.0

MIRTEC, “The Global Leader in Inspection Technology”, announced that it will premier its Technologically Advanced AOI Equipment at SMTAI Orlando 2012

MIRTEC Corp

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

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