Industry Directory: bga soldering problem short (17)

ACI Technologies, Inc.

ACI Technologies, Inc.

Industry Directory | Design / IPC Standards Certification Center / Consultant / Service Provider / Training Provider

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

PACE Worldwide

PACE Worldwide

Industry Directory | Manufacturer of Assembly Equipment / Repair / Rework / Soldering / IPC Standards Certification Center / Training Provider

A recognized developer of solutions for the assembly & repair of highly advanced electronics. PACE provides products/training for the soldering, rework & repair of pcb's, specializing in BGA rework, desoldering & fume extraction.

New SMT Equipment: bga soldering problem short (1373)

DJ-9000 DispenseJet Jet Technology

DJ-9000 DispenseJet Jet Technology

New Equipment | Dispensing

Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on

Nordson ASYMTEK

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

Electronics Forum: bga soldering problem short (1081)

BGA short

Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9

Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials

BGA short

Electronics Forum | Thu Dec 15 11:06:05 EST 2005 | Samir Nagaheenanajar

You might wanna try a small reduction in your stencil aperture. For example, for a 30-mil pad go 26-mil square aperture with 8 to 10-mil radius on your corners. Also, look at your designs. Is there enough resist between your pad and ball? Another

Used SMT Equipment: bga soldering problem short (2)

YesTech YTX-X3 3D X-Ray

YesTech YTX-X3 3D X-Ray

Used SMT Equipment | X-Ray Inspection

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Automated Inspection for: Opens & shorts Insufficient / excess solder Lif

Capital Equipment Exchange

SMTmax QM2100 Tabletop Automatic Pick

SMTmax QM2100 Tabletop Automatic Pick

Used SMT Equipment | SMT Equipment

Video demonstration: http://www.youtube.com/watch?v=OviAm7d1S7g • One Y-direction servo motor, rather than two, overcomes misalignment problem; air actuate feeders instead head-punch in advance feeders • 3000-3500 estimated pph(parts per hour) • 21

SMTmax

Industry News: bga soldering problem short (113)

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: bga soldering problem short (6)

Fuji Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine

Fuji Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine

Parts & Supplies | Pick and Place/Feeders

Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00

KingFei SMT Tech

Fuji Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine

Fuji Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine

Parts & Supplies | Pick and Place/Feeders

Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00

KingFei SMT Tech

Technical Library: bga soldering problem short (296)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Videos: bga soldering problem short (21)

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

Videos

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Automated Inspection for: Opens & shorts Insufficient / excess solder Lif

Capital Equipment Exchange

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

Training Courses: bga soldering problem short (1)

Non-Destructive BGA/Area Array Component Rework - Technical Workshop

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

PACE Worldwide

Events Calendar: bga soldering problem short (2)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Vision Engineering Inc.

Career Center - Resumes: bga soldering problem short (29)

SMT Process Engineer

Career Center | Fremont, California USA | Engineering,Production

4 years of PCB assembly process.

Global Product Specialist

Career Center | Singapore, Singapore | Engineering,Production

I am a result/goal-oriented engineer with 20 years of experience in Surface Mount Technology (SMT) environment, of which 7 years were heavily involved in field service and field application for Automated Optical Inspection (AOI) machines. I partici

Express Newsletter: bga soldering problem short (964)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part

Partner Websites: bga soldering problem short (104)

BGA Rework Station - ML-5860 - QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/product-item/bga-rework-station/

℃, for 4-8 hours to remove internal moisture of the PCB and BGA, to prevent the burst phenomenon when heating. 2 、 Remove Place the PCB board into the bracket on the repair station,and select the appropriate hot air reflow nozzle,and set the appropriate soldering curve,press the open button until it finishes,and

Qinyi Electronics Co.,Ltd

Soldering Aids and Soldering Aid Kits

Beau Tech | https://www.beautech.com/bt_full_line.pdf

Soldering Aids and Soldering Aid Kits SH-80 Flat Shockproof Vulcan Spudger, Double Beveled and Conical Ends, 6” x 1/4” SOLDERING AIDS SH-83 “Orange

Beau Tech


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