Industry Directory: bga soldermask (1)

SolderMask Inc.

SolderMask Inc.

Industry Directory | Manufacturer of Assembly Material / Soldering

Manufacturer of Laser Cut & Chemical Etched Stencils.

New SMT Equipment: bga soldermask (3)

Laser Cut Stencils

Laser Cut Stencils

New Equipment | Solder Paste Stencils

SolderMask Services - Stencils and Custom Stencils Since 1994, SolderMask, Inc. has fabricated solder paste stencil using a photo-chemical etching process. In 1998, we installed our first laser to cut the apertures of the solder paste stencil. Now,

SolderMask Inc.

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

Electronics Forum: bga soldermask (50)

BGA PAd Soldermask

Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow

Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!

BGA PAd Soldermask

Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow

Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!

Industry News: bga soldermask (11)

Electropac Montreal Buys New Equipment

Industry News | 2003-06-18 08:04:27.0

Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation

SMTnet

SMTA International Call for Papers - Deadline Approaches

Industry News | 2003-02-18 09:39:06.0

Encourages You to Submit an Abstract for this Year's Conference

Surface Mount Technology Association (SMTA)

Technical Library: bga soldermask (10)

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Voids in Solder Joints

Technical Library | 2019-12-12 21:43:43.0

Presented at SMTA Boise Expo and Tech Forum, March 20, 2018

Intel Corporation

Videos: bga soldermask (1)

SIPAD Systems, Inc.

SIPAD Systems, Inc.

Videos

SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi

SIPAD Systems Inc.

Events Calendar: bga soldermask (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: bga soldermask (437)

Partner Websites: bga soldermask (8)


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