Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon
| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Career Center | Delavan, Wisconsin USA | Production
*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int
Career Center | , | 2018-02-12 15:39:39.0
MR PCB Rework Technician (Intel Contract Employee) Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions,
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Assembly Process Variables Voiding At A Thermal Interface News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effects of Assembly Process Variables On Voiding At A Thermal
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
. Data are reported for three distinct thermal cycling profiles, 0/100°C, -40/125°C, and -55/125°C, as characteristic life η (the number of cycles to achieve 63.2% failure) and slope ß
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