New SMT Equipment: bga void in ipc-610 (4)

X-ray inspection machine Shuttle Star model NDT-X3600A 2.5~3D imaging system Made in China

New Equipment | Test Equipment

feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat

Shuttle Star Technology Co., Ltd.

shuttlestar X-ray inspection machine Shuttle Star model NDT-X3600A 2.5~3D imaging system Made in China

shuttlestar X-ray inspection machine Shuttle Star model NDT-X3600A 2.5~3D imaging system Made in China

New Equipment | Test Equipment - Bond Testers

feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat

Shuttle Star Technology Co., Ltd.

Electronics Forum: bga void in ipc-610 (77)

Standard for BGA void

Electronics Forum | Wed Oct 23 14:44:58 EDT 2002 | mzaboogie

Hi Ben, IPC610 has a pass/fail of 25% of ball volume. Hope this helps

what kind of void test do u perform in paste industry

Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker

I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free

Industry News: bga void in ipc-610 (11)

Advances in Lead-Free Alloys, Reliability, Halogen-Free and Counterfeit Components Highlight IPC APEX EXPO 2012 Technical Conference

Industry News | 2011-12-14 15:47:27.0

Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.

Association Connecting Electronics Industries (IPC)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

Technical Library: bga void in ipc-610 (16)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Express Newsletter: bga void in ipc-610 (479)

SMTnet Express - October 10, 2019

SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few

SMTnet Express - October 3, 2018

SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints

Partner Websites: bga void in ipc-610 (115)

IPC A-610H: Acceptability of Electronic Assemblies

| https://store.aciusa.org/IPC-A-610G-Acceptability-of-Electronic-Assemblies-P129.aspx

  IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610H illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable

IPC CIT Training - ACI Technologies, Inc.

| https://www.aciusa.org/training/ipc-cit-training/

full description here… Enroll Now + IPC A-610 CIT Certification - REMOTE Overview: The IPC-A-610 is an indispensable criterion necessary to achieve the highest quality productivity in electronics manufacturing and inspection. This course was developed to


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