Torrey S. Crane manufactures a complete line of industrial solders ranging from pure tin and lead with alloys with silver,bismuth,antimony,and cadmium.Crane solders meet and exceed J-STD-006,QQS-571and ASTM B32 standards and are ISO 9002 CERTIFIED
Hallmark Metals Corp. A premier leader in the CASTING ALLOY and SOLDER Industry. Sellers of Tin, Bismuth, Low melt alloys, Pewter sheet, Antimony, Hard and Soft lead, Babbit, Custom alloys, Zinc alloys, Cadmium,
New Equipment | Solder Materials
AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste im
New Equipment | Solder Materials
WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, cabl
Electronics Forum | Tue Feb 08 15:05:22 EST 2005 | Keith Lengling
I have several memory devices that have 2% bismuth in the lead coating. Is this enough bismuth to be concerned over the formation of a low temperature SnPbBi alloy? What are the allowable limits for bismuth in an SnPb process for both SMT and through
Electronics Forum | Tue Feb 08 22:04:34 EST 2005 | davef
Tough to say. Can you accept the loss of strength of your solder connection if upto 2% of the solder is affected? * Lead and bismuth alloys can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of the eutectic all
Industry News | 2023-03-16 14:31:59.0
The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.
Industry News | 2016-02-23 20:06:15.0
The SMTA is pleased to announce the program for the 10th Annual International Conference on Soldering and Reliability being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework SMTnet Express December 20, 2012, Subscribers: 26064, Members: Companies: 9072, Users: 34080 Advantages of Bismuth-based Alloys for Low Temperature Pb
| https://pcbasupplies.com/wp-content/uploads/2023/05/MSDS-BC-10.pdf
. Components CAS Number % HSIS TWA HSIS STEL Copper (Cu) 7440-50-8 Iron (Fe) 7439-89-6 7439-92-1 7440-36-0 Bismuth (Bi) 7440-69-9 Phosphorous (P) 7723-14-0 Zinc (Zn
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. It melts at 227 deg C. Tin-Bismuth. Sn and Bi form a eutectic alloy at 42%Sn and 58% Bi, which melts at an excessively low temperature of 138 deg C. However, at 3
