New Equipment | Solder Materials
AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste im
New Equipment | Solder Materials
Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S
Electronics Forum | Mon Oct 31 19:37:16 EDT 2022 | emeto
Just because you can't add copper to the board, doesn't mean you can't add copper to the panel. Redesign panel, where board house can add copper to the panel to balance the board a little better. I would advise against low melting solder alloys on cu
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Industry News | 2013-02-14 08:18:47.0
IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications
Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework SMTnet Express December 20, 2012, Subscribers: 26064, Members: Companies: 9072, Users: 34080 Advantages of Bismuth-based Alloys for Low Temperature Pb
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Leadfree PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 1 of 24 Rev Level: 1 Rev Date: 1/03/01 A Practical Investigation Into the Use of No Lead Solders for SMT Reflow Heller Industries and Soldering Technology David Heller and Jim Raby Project Title
.gif)
