Panasonic AI part X005-2022 Panasonic AI part X005-2022 INQUIRY Panasonic AI part X005-2022 Specifications: Panasonic AI part X005-2022 Part Number Description Part Number Description
SMT Offline AOI Inspection Machine ZW 500 Dimension:900*1100*1350 mm PCB width:30x30-450x330mm Inspection Component: 0402 chip Weight:Aprox. 450kg Product description: SMT Offline AOI Inspection Machine ZW 500 INQUIRY SMT Offline
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc
>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-adhesive-application.php
; typically ceramic, gold, and FR4 substrates. It makes the electrical and adhesive connection between device and electrical pad and substrate
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5
Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
