Industry Directory | Consultant / Service Provider / Manufacturer
Cogiscan provides factory-wide electronics manufacturing traceability (TTC), MSD control, component set up verification, PCB assembly error-proofing, components inventory management.
New Equipment | Assembly Services
The board is designed by customer and it's for Air Purification control PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss:
New Equipment | Assembly Services
The board is designed by customer and it's for Power Bank PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss: 1.6mm Surface:
Electronics Forum | Wed Dec 14 10:19:56 EST 2016 | jaktechie
Hello, I am new to this forum but I have a question. We use an Orbotech Discovery Ultra to inspect our photo-tools. We currently use this lint free paper as a contrast material underneath the phototool since the vacuum bed on the AOI is black and ou
Electronics Forum | Fri May 21 10:57:23 EDT 2004 | Frank
Does your machine have pattern recognition, so you can program a corner of a trace, or some other unique feature of the board?
Industry News | 2014-04-11 09:15:04.0
IPC – Association Connecting Electronics Industries®, working in partnership with the Automotive Industry Action Group (AIAG), the Conflict-Free Sourcing Initiative (CFSI) and the Japan Electronics and Information Technology Industries Association (JEITA), recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Technical Library | 2023-06-02 14:13:02.0
This work examines the use of dual-material fused filament fabrication for 3D printing electronic componentsand circuits with conductive thermoplastic filaments. The resistivity of traces printed fromconductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillerswas found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of resistors with valuesspanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fracturedeasily, but the copper-based filament could be bent at least 500 times with little change in its resistance.Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filamenthad an impedance similar to a copper PCB trace at frequencies greater than 1 MHz. Dual material3D printing was used to fabricate a variety of inductors and capacitors with properties that could bepredictably tuned by modifying either the geometry of the components, or the materials used to fabricatethe components. These resistors, capacitors, and inductors were combined to create a fully 3Dprinted high-pass filter with properties comparable to its conventional counterparts. The relatively lowimpedance of the copper-based filament enabled its use for 3D printing of a receiver coil for wirelesspower transfer. We also demonstrate the ability to embed and connect surface mounted components in3D printed objects with a low-cost ($1000 in parts), open source dual-material 3D printer. This work thusdemonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composedof either embedded or fully-printed electronic components.
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