Technical Library: board delamination (Page 1 of 1)

Cleaning Before Conformal Coating

Technical Library | 2021-10-06 17:48:52.0

Cleaning PCBs before conformal coating removes potentially harmful and unknown contaminants from the board's surface resulting in better adhesion of the conformal coating and thereby preventing delamination. Cleaning PCBs can ultimately prevent issues like leakage current, electrochemical migration and coating failures. From a production standpoint, it can help to decrease the cost of labor and time needed for the re-work of the boards.

ZESTRON Americas

Controlling Moisture in Printed Circuit Boards

Technical Library | 2019-05-01 23:18:27.0

Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.

CALCE Center for Advanced Life Cycle Engineering

Influence of Plating Quality on Reliability of Microvias

Technical Library | 2016-05-12 16:29:40.0

Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.

CALCE Center for Advanced Life Cycle Engineering

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