Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Wed Dec 23 03:33:14 EST 1998 | Charles Stringer
Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. We need t
Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F
| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Used SMT Equipment | Board Cleaners
• Vintage 2008 • PLC based Control System • 480V AC 60Hz • Auto Stop/Stand by Mode • Final Rinse low flow sensor and alarm • Mach II Drying System • 2 upper, 2 lower jet manifolds • 15 HP blower upgrade • 18” Off Load Extension • Integrated
Industry News | 2016-09-14 20:57:09.0
GPD Global will exhibit and have live demonstrations of the Continuously Volumetric Pump in Booth# 424 at the upcoming SMTA International 2016 Conference and Exhibition.
Industry News | 2016-09-29 21:52:08.0
GPD Global continues to establish its presence by exhibiting at trade shows in the nation and globally with our affiliates. The most recent trade shows were SMTA International 2016 in Rosemont, IL and Semicon Taiwan. We strengthened our brand globally with these successful events.
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: AP UP P
Parts & Supplies | SMT Equipment
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: A
Technical Library | 2017-02-01 02:20:42.0
BGA Rework Course encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. There should be 'one-stop' solution, that offers a wide range of ball grid array rework and repair services.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | DALLAS, Texas USA | Production
Extensive, diverse background in Production Management and Warehousing in state of the art manufacturing environments. Exceptional ability to translate corporate strategies and orchestrate between business components, resulting in deliverables on ti
Career Center | 10th of ramadan, Egypt | Engineering,Maintenance,Management,Production
• Excellent Analytical, inter-personal and communication skills • Ability to work effectively in teamwork • Ability to set and achieve goals and work under pressure • Learn quickly, hard worker • Capable of study and research acti
| https://www.feedersupplier.com/sale-13119466-193377-smt-screen-printer-parts-dek-board-stop-kit-lip-seal.html
193377 SMT Screen Printer Parts DEK Board Stop Kit Lip Seal Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Heller Industries Inc. | https://hellerindustries.com/parts/101859/
101859 - TENS.SPRING STOP Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
