Industry Directory | Manufacturer
Twisted Traces, a US-based leader in the printed circuit board manufacturing industry, offers unmatched benefits on three fronts: quality, cost, and on-time delivery.
The W. M. Hague Company distributes interconnect test systems for bare board test and semiconductor substrate test. In addition the W. M. Hague Co. distributes conformal coating systems (both dip and spray), SIR test systems and Warpage testers.
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Electronics Forum | Mon Mar 03 11:07:40 EST 2003 | MA/NY DDave
Hi In addition to what DaveF gave you which you should look at first Search the archives for warp bow twist warpage etc. A Lot of treads exist. Many of the larger OEM's and even the Mil have historically created their own documents for acceptable
Electronics Forum | Mon Feb 02 16:42:03 EST 2004 | davef
Bow & twist for bare boards and panels: IPC-A-610 1.5% for PTH only and 0.75% for SMT. So, what are you doing to these poor boards to make them warp?
Used SMT Equipment | Screen Printers
Description: Jet Printer Details: • Software 1.9.3A • No Stencil • Automatic board stretch and board warpage compensation • CAD / Gerber Import all common formats • On the spot revisions
Used SMT Equipment | Conveyors
2016 Electro Design for Mycronic MB702 500mm Conveyor Details: Conveyor Length: 500mm Edge Belt SMEMA Interface Auto Width Adjustment Board Length: 2.8" - 18.5" Board Width: 2.0" - 20.0" Board Thickness: 0.016" - 0
Industry News | 2013-10-08 15:37:23.0
MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems in Hall A2, Stand 578 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
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Parts & Supplies | SMT Equipment
03047090-01 Unlocking Tool for Q8 03047212-02 READ HEAD MS101 X-AXIS/HS-D 03047214-02 READ HEAD MS101 Y-AXIS/HS-D 03047215-02 Incremental encoder MS101 X-axis/S/F-D 03047216-02 Incremental encoder MS101 Y-axis/S/F-D 03047223-02 WP
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Parts & Supplies | SMT Equipment
03047223-02 WPC controller board 03047255-01 Barcode/WPC 03047273-01 Bero Reference-point feed axis 03047277-01 End pos. Feed axis motor side 03047282-02 Crash light barrier high components 03047285-01 Bero anti-twist device magazine carrier 03
Technical Library | 2009-12-09 19:47:15.0
For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density.
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Mayaguez, Puerto Rico | Engineering,Production
Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/board-warp-sensing
Information Datasheets Board Warp Sensing - English Board Warp Sensing - German Board Warp Sensing Laser-Based Measurement for Improved Process Control Features and Benefits - Measures board warpage and downward deflection of circuit board during preheating
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High Speed SMT AOI Machine in PCB Board Off-Line Model I.C.T-V8 from China manufacturer - I.C.T English Français Pусский Español Português Deutsch Italiano 日本語 한국어 Tiếng Việt Türk dili Home About Us Company Profile
