.jpg)
Industry Directory | Equipment Dealer / Broker / Auctions
Buyer, Seller, Broker of Electronic Assembly Equipment
Industry Directory | Distributor
Buys,sells, rents, consults on vapor degreasers
New Equipment | ESD Control Supplies
BEST Inc. can provide your custom foam cutting insert needs. Whether you have an anti-static (pink) closed or open foam packaging material or other kind of foam that needs to be cut-BEST Inc. can be your source. Once you have the materials in hand yo
New Equipment | Rework & Repair Equipment
Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of
Electronics Forum | Tue Aug 01 16:39:24 EDT 2006 | slthomas
Our problem is with the chamber beneath the drying section, where the blower is. The drying section vents directly into the chamber beneath it where the blower intake is, which is great for equalizing pressure but really counter to presenting dry air
Electronics Forum | Thu Jul 26 12:42:37 EDT 2007 | cman
Does anyone know of a small machine (table top would be nice) that could be used to wash mis-prints or small batches of boards? We have 2 inline systems but they are DI only and once and a while a soaponified system would be nice. Looking for spray o
Used SMT Equipment | Board Cleaners
WestKleen Washer/Cleaner Features: Dual Pumps with Additional Blower Motor o 18" Process Width & External Rinse Sink
Used SMT Equipment | Board Cleaners
Details: • 240v – 1 Phase – 60Hz Condition: Complete and Operational when taken offline 2/19 Location & Shipping: USA / FOB Origin Availability: Immediate for purchase
Industry News | 2003-04-25 08:11:22.0
Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.
Industry News | 2014-03-25 09:35:06.0
Count On Tools Inc. (COT)announces the release of the new support plates for its line of ezLOAD Board Supports.
Parts & Supplies | Circuit Board Assembly Products
JUKI 750 board card More SMT JUKI feeder parts in stock E1506706000 Juki Feeder Spring E2300706000 JUKI 16MM Feeder Spring E3245760000 JUKI Ratchet SP 32MM Feeder Spring E3306706000A JUKI FF 12MM Feeder Winding Reel E3335706000 Juk
Parts & Supplies | Circuit Board Assembly Products
YAMAHA KHY-M5802-02 YG12, head of Z axis servo card 1. KHY-M5802-01 Z SERVO UNIT ASSY 2. KHY-M5802-02 Z SERVO UNIT ASSY 3. KHY-M5802-020 Z SERVO UNIT ASSY 4. KHY-M5802-021 Z SERVO UNIT ASSY 5. KHY-M5848-020 pbf LIN
Technical Library | 2008-12-11 01:15:56.0
Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams resulted in materials that were much more flammable. The widespread use of BFRs initiated in the 1970s with the explosion of electronics and electrical equipment and housings. For the US market, all of these products must conform to the UL 94 flammability testing specifications. In fact, the most common printed circuit board (PCB) in the electronics industry, FR-4, is defined by its structure (glass fiber in an epoxy matrix) and its compliance to UL 94 V0 standard.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
J9060367A NON IT BOARD J9060366A IT SLAVER BOARD J7066024A COUPLER BKT1
J9060367A NON IT BOARD J9060366A IT SLAVER BOARD J7066024A COUPLER BKT1 J9065229A
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Broadband Printing a A Paradigm News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Bromide-Free Options for Printed Circuit Boards Flame retardants have been around since
ORION Industries | http://orionindustries.com/applications.php
Enclosure Shieldings,Component Shieldings,Board Shieldings,Seals, Antistatic Bags & Packaging Foam ISO 9001:2015 Registered AS 9100 Registered UL Recognized SAM Registered ROHS Compliance Common Applications Enclosure Sealing Applications Component Level Shielding Entire Board Shielding Drive Seal
Heller Industries Inc. | https://hellerindustries.com/parts/3537/
3537 - Washer Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens
.gif)
