Electronics Forum | Sat Dec 01 09:09:24 EST 2001 | davef
Sounds like a perfect place to start. Sure we all have different perceptions of fun, don't we? Trial by fire, eh? ;-) A prediction: Your cost accountants are going to freak when they compare the production costs for this board to the more famili
Industry News | 2008-09-21 02:27:24.0
Minneapolis, MN � During the Annual Meeting at SMTA International, August 20 at Disney's Coronado Springs Resort and Convention Center in Orlando, FL, the SMTA honored members who have shown exceptional service to the association and the industry.
Samsung Mounter CP60 Servo IF Board J9060235A [CP60HP-SERVO IF BOARD ASSY Samsung Mounter CP60 Servo IF Board J9060235A [CP60HP-SERVO IF BOARD ASSY Email:email@example.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 过滤芯 1. 原厂全新SAMSUNG
SAMSUNG FEEDER FIXED TAPE UP REEL J9065087 specs: SAMSUNG FEEDER FIXED TAPE UP REEL J9065087 J6711119A UNION Y FITTING [KQ2U04-06] J9060351A FEEDER BASE LEFT COVER PCB, NON DOCKING[ J9060347B FEEDER BASE LEFT BOARD, NON DOCKING[REV J1301188 FITT
Technical Library | 2018-02-28 22:28:30.0
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Joint Shear Force Heller Industries Jianbiao Pan1,
] J91672048B VS_X_POWER_EXT_CABLE_ASSY J91672049B VS_X_ENCODER_EXT_CABLE_ASSY MC13-000124 SM411+ BALL SPLINE AM10-000096A A/S PART-THETA_SPINDLE_PULLEY_ASSY J1301181 BOB FITTING [M-5ALU-4