Model name: NPM-W Substrate size Monorail * 1 Overall installation: L50mm×W50mm ~ L750mm×W550mm 2 positions: L50mm×W50mm ~ L350mm×W550mm Dual-track * 1 Monorail transmission: L50mm×W50mm ~ L750mm×
YAMAHA YSM10 PICK AND PLACE MACHINE YAMAHA YSM10 NEW AND USED MACHINE YAMAHA YSM10 features: 1. The entry-level model of the surface mounting machine that achieves the world's fastest ※ 46000CPH performance in the same grade of 1
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Wed Oct 17 17:36:32 EDT 2018 | davidsmullins
Thanks for all the input! I should clarify a couple things. We are a contract manufacturer; we simply build to our customer's design prints. This particular board, we outsourced because of some requirements for processes we don't do in-house. So, we
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YAMAHA YS24 Ultra-High Speed Module SMT Machine Model: YS24X Object substrate: L50 * W460mm W50mm ~ L700 SMT capacity: (best conditions) 54000 CPH (0.067 seconds/CHIP) SMT precision: when the company evaluation by using standa
Used SMT Equipment | Pick and Place/Feeders
Product number: YS24X Products in detail YS24X small high-speed placement machineYS24X general module satz Ⅱ automatically switched tray 54000 CPH (0.067 SEC/CHIP) general placementmachine best SMT capacity Satz Ⅱ automatically switched tray corr
Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
Industry News | 2017-05-11 17:06:16.0
Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: JUKI Country: Japan Condition: Original New Model: 500 PN: 40011046 Name: NOZZLE ASSEMBLY Small Durable SMT Nozzle 40011046 JUKI Brand 500 Nozzle Assembly Description: Original Place: Japan Name: JUKI No
Parts & Supplies | Assembly Accessories
SMT REPLACEMENT SPARE PARTS JUKI 750 760 FEEDER 2 CABLE ASM E93717250A0 JUKI Nozzle Specifications: Brand Name JUKI FEEDER CABLE Part number E93717250A0 Model Ensure Tested buy juki Guarantee 1 month usage for machine JUKI 750 760 Sell &
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Technical Library | 2015-02-27 16:46:30.0
During the last period of newly assembled electrical devices (pcbs), new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements based on the automotive and industrial industry. In the narrow gaps under components, residues can accumulate more by the capillary forces. This is not that much a surface resistance than an interface issue. Also that the flux residues under such types of components creates interaction with the solder resists from the pcb, as well as the component body was not completely described in the standard SIR measurement. On the other hand also, electrical influence with higher voltage creates new terms and conditions, in particular the combination of power and logic in such devices. The standard SIR measurement cannot analyze those combinations.The paper will discuss the requirements for a measurement process, and will give results. The influences of the pcb and component quality will also be discussed. Furthermore it will describe requirements for nc solder paste to increase the chemical/thermical/electrical reliability for whole devices
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