Industry Directory: bond (105)

ISVI - Industrial Sensor Vision International Corporation

Industry Directory | Inspection

Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.

Bond Impex

Industry Directory | Adhesives / Dispensing

we requrie screen printing two part adhesive

New SMT Equipment: bond (577)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

New Equipment | Cleaning Agents

pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se

ZESTRON Americas

Electronics Forum: bond (631)

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

COB and wire bond

Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you

Used SMT Equipment: bond (33)

Dage 4000 pull tester machines

Dage 4000 pull tester machines

Used SMT Equipment | Labeling Systems

CBP / TP 5Kg Cold Bump Pull/ Tweezers Pull Cartridge along with JAW Nordson Dage 4000 Bond Tester DAGE 4000 CBP/TP 5KG Qty:2  Condition : Excellent working condition with many Modules all form Europe user Email:13560819457@139.com

HongCheng import & Export co.,Ltd

Fancort Hot Bar Selective Sold

Fancort Hot Bar Selective Sold

Used SMT Equipment | Soldering - Selective

Thermode Length 100mm, Stroke 50mm, Flex Bond 1/2inch Force 10 to 100N @ Bar Preheat/Reflow 0-200 Seconds Work Area 260X200mm Temp Range 25 to 400c in 1 degree Intervals Voltage 110/220 CCD Camera System with Monitor Condi

Lewis & Clark

Industry News: bond (864)

GPD Global’s PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Ravi Parthasarathy, ZESTRON, to Present at IMAPS’s Advances in Semiconductor Packaging Exhibition

Industry News | 2015-09-22 18:05:39.0

ZESTRON is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields” at IMAPS’s Advances in Semiconductor Packaging Exhibition on September 24th.

ZESTRON Americas

Parts & Supplies: bond (49)

Fuji W1039A FLAT WASHER XPF

Fuji W1039A FLAT WASHER XPF

Parts & Supplies | Assembly Accessories

 FUJI S3138T SWITCH PHOTO  PZ2 FUJI S3139A SWITCH PHOTO  EX4 FUJI S3141B SWITCH PHOTO  DL- FUJI S3141E SWITCH PHOTO FTV7 FUJI S3141S SWITCH PHOTO UM-T FUJI S3141W SWITCH PHOTO  UM- FUJI S3141Y SWITCH PHOTO UM-Z FUJI S3

KingFei SMT Tech

Fuji PZ3672 Filter FUJI NXT

Fuji PZ3672 Filter FUJI NXT

Parts & Supplies | Assembly Accessories

 FUJI S3138T SWITCH PHOTO  PZ2 FUJI S3139A SWITCH PHOTO  EX4 FUJI S3141B SWITCH PHOTO  DL- FUJI S3141E SWITCH PHOTO FTV7 FUJI S3141S SWITCH PHOTO UM-T FUJI S3141W SWITCH PHOTO  UM- FUJI S3141Y SWITCH PHOTO UM-Z FUJI S3

KingFei SMT Tech

Technical Library: bond (58)

Flip Chip Rework

Technical Library | 2019-05-21 17:34:08.0

Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.

ACI Technologies, Inc.

Wedge Bonding Tool Selection

Technical Library | 2019-05-23 10:30:22.0

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.

ACI Technologies, Inc.

Videos: bond (47)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

This is a brief functional demonstration of the Xylon Cheetah X-ray.  The video shows the machine x-ray components on a pcb.  In the video, you can see wire bonds and solder voids

This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids

Videos

This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids. This 2011 Cheetah is available at the Capital Equipment Exchange.

Capital Equipment Exchange

Training Courses: bond (4)

Chip Scale Manufacturing Training Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Technical Training Center

Events Calendar: bond (34)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Quality Adhesive Technologies from LOCTITE - Free Workshop

Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA

Quality Adhesive Technologies from LOCTITE - Free Workshop

ACI Technologies, Inc.

Career Center - Resumes: bond (9)

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Technical Specialist

Career Center | SanPedro, Philippines | Maintenance,Production

Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan

Express Newsletter: bond (111)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding

Partner Websites: bond (2889)

Clariant successfully places CHF 150 million domestic bond

| https://www.clariant.com/en/Corporate/News/2014/09/Clariant-successfully-places-CHF-150-million-domestic-bond

Clariant successfully places CHF 150 million domestic bond Search Share Region Contact Close Close Search If you are searching for Safety Data Sheets, please visit our Document Finder All Results

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more


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Fluid Dispense Pump Integration

One-stop Platform For All Your Need For SMT - QYSMT
Dual Lane Reflow Oven

Component Placement 101 Training Course
PCB Depanelizers

500+ original new CF081CR CN081CR FEEDER in stock