Industry Directory: bond strength (5)

Master Bond

Industry Directory | Adhesives / Dispensing

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond specializes in epoxies, silicones and uv curable polymer systems.

Aculon

Industry Directory | Adhesives / Dispensing

The leading provider of easy to apply nano-tech surface modification technologies.

New SMT Equipment: bond strength (112)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Qualification of Bare Boards

Qualification of Bare Boards

New Equipment | Test Services

Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and

ACI Technologies, Inc.

Electronics Forum: bond strength (72)

solder strength

Electronics Forum | Fri Sep 02 09:02:10 EDT 2005 | dougs

you tell me, the customer has started to pull at some of the leads of some IC's with tweezers while de-bugging boards that had failed in the field, he was able to pull some of the leads away from the solder joints, we feel he may be over-doing it a

solder strength

Electronics Forum | Wed Sep 07 10:41:24 EDT 2005 | D.B. Cooper

We've seen the same thing - leads of QFPs not as strong as we'd like them to be. In the past 4 years no problem, this Spring they start failing. Touch a solder iron to it and it solders fine. After crunching some data, we found that both QFPs fail

Industry News: bond strength (85)

> FREE Registration for June 12-13, held in The Netherlands

Industry News | 2013-05-01 12:45:51.0

Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht

Nordson ASYMTEK

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

Technical Library: bond strength (6)

An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates

Technical Library | 2016-01-12 11:03:35.0

With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.

YINCAE Advanced Materials, LLC.

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

Technical Library | 2021-12-29 19:37:20.0

The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.

Czech Technical University in Prague

Videos: bond strength (13)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Events Calendar: bond strength (1)

Adhesives & Bonding Expo

Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA

Adhesives & Bonding Expo

Scheugenpflug Inc.

Career Center - Resumes: bond strength (1)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Express Newsletter: bond strength (150)

Partner Websites: bond strength (526)

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test

Adhesive Transfer Tapes with Adhesive 300LSE, 9453LE, 9471LE, 9471LE

ORION Industries | http://orionindustries.com/pdfs/300lse.pdf

Adhesive 300LSE is a hi-strength acrylic adhesive that provides a very high bond strength to most surfaces. • Excellent bond to low surface energy plastics, such as polypropylene and powder coatings

ORION Industries


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Comprehensive Analytical Services and Support

High Throughput Reflow Oven
Inline Cleaning Machine Hydro-clean Array

MSD Dry Cabinets
Cleaning Machine For Electronic Assembly

High Speed Precision In-Line SPI System - Mirtec MS-11
Electronic Solutions R3

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