Videos: bond wedge enig (Page 1 of 1)

Viscom AOI

Viscom AOI

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High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

STI Capabilities

STI Capabilities

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The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

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bond wedge enig searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
Sell Used SMT & Test Equipment

Component Placement 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

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Thermal Transfer Materials.