Industry Directory | Manufacturer's Rep
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Manufacturer of Bare PCBs / Assembly / Contract Manufacturer / OEM
1-20 layers PCB manufacturer, focusing on metal core pcb, multi-layer PCB, fast PCB and middle-small batch PCB. Min. circuit width & spacing: 3mil. UL, ISO9001, ROHS,ISO14001 certified.
Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
Electronics Forum | Tue Apr 20 17:19:38 EDT 2004 | Mike
1. Which manufacturers have proven the immersion silver is reliable after solder joint assembly? 2. Who has published guidelines for storing and handling immersion silver boards? 3. Is the immersion silver finish wire bondable? epoxy bondable? or j
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Industry News | 2017-02-28 20:35:59.0
ZESTRON is pleased to announce that it will host “Why Clean PCBs” on Thursday, March 23rd, from 1:30 PM to 2:30 PM EDT. This is the first installment of ZESTRON Academy’s 2017 Cleaning Webinar Series, and will be presented by our Application Technology Manager, Umut Tosun, M.S.Ch.E.
Industry News | 2016-03-18 11:53:18.0
In recognition of her extraordinary contributions to IPC and the electronics industry, Patricia (Patty) Goldman, managing editor, I-Connect007, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® at the Las Vegas Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/medical
. Plasma can also be used to remove titanium oxide from laser welding processes. It is a superior final cleaning step that helps improve the biocompatibility and bondability of many medical product or components
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
) offer benefits such as having greater wire bondability, tighter pitch, and contact usage. However, as you would expect from anything made of gold, these types of finishes are significantly more expensive
