Industry News: bondability of overplated gold (1)

Long-time IPC Volunteer, Patricia Goldman Inducted Into IPC Hall of Fame

Industry News | 2016-03-18 11:53:18.0

In recognition of her extraordinary contributions to IPC and the electronics industry, Patricia (Patty) Goldman, managing editor, I-Connect007, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® at the Las Vegas Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)

Technical Library: bondability of overplated gold (5)

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Technical Library | 2019-04-17 21:29:14.0

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Jet Propulsion Laboratory

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Technical Library | 2013-08-29 19:52:43.0

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...

Agilent Technologies, Inc.

Express Newsletter: bondability of overplated gold (74)

SMTnet Express - September 7, 2017

SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs


bondability of overplated gold searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t net
  1 2 3 4 5 6 7 8 Next
Dual Lane Reflow Oven

Want to know where to find the best AOI system? - Read testimonials.
Voidless Reflow Soldering

One-stop Platform For All Your Need For SMT - QYSMT
2021 IPC Training Schedule

PCB Assembly Supplies - ONLINE STORE
Jwide professional SMT machines manufacturer

SMT Machines, Parts & Accessories - Used and New