Industry Directory | Inspection
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Cleaning Agents
pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef
Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service
Used SMT Equipment | Labeling Systems
CBP / TP 5Kg Cold Bump Pull/ Tweezers Pull Cartridge along with JAW Nordson Dage 4000 Bond Tester DAGE 4000 CBP/TP 5KG Qty:2 Condition : Excellent working condition with many Modules all form Europe user Email:13560819457@139.com
Used SMT Equipment | Soldering - Selective
Thermode Length 100mm, Stroke 50mm, Flex Bond 1/2inch Force 10 to 100N @ Bar Preheat/Reflow 0-200 Seconds Work Area 260X200mm Temp Range 25 to 400c in 1 degree Intervals Voltage 110/220 CCD Camera System with Monitor Condi
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2015-09-22 18:05:39.0
ZESTRON is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields” at IMAPS’s Advances in Semiconductor Packaging Exhibition on September 24th.
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Parts & Supplies | Assembly Accessories
FUJI S3138T SWITCH PHOTO PZ2 FUJI S3139A SWITCH PHOTO EX4 FUJI S3141B SWITCH PHOTO DL- FUJI S3141E SWITCH PHOTO FTV7 FUJI S3141S SWITCH PHOTO UM-T FUJI S3141W SWITCH PHOTO UM- FUJI S3141Y SWITCH PHOTO UM-Z FUJI S3
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Parts & Supplies | Assembly Accessories
FUJI S3138T SWITCH PHOTO PZ2 FUJI S3139A SWITCH PHOTO EX4 FUJI S3141B SWITCH PHOTO DL- FUJI S3141E SWITCH PHOTO FTV7 FUJI S3141S SWITCH PHOTO UM-T FUJI S3141W SWITCH PHOTO UM- FUJI S3141Y SWITCH PHOTO UM-Z FUJI S3
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids. This 2011 Cheetah is available at the Capital Equipment Exchange.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA
Quality Adhesive Technologies from LOCTITE - Free Workshop
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
