New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Automated Desk Dispensing Machine - Efficient and Convenient ❙ Introduce of Desk Automatic Dispensing Machine Semiconductor packaging, PCB electronic parts fixation and protection, mobile phone, notebook shell bonding, LCD glass substrate packag
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
New Equipment | Assembly Services
Printed Circuit Board Assemblies Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies. Our process capabilities include: 01005
Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable solutions for today's electronic devices. As a result, companies in the surface mount technology (SMT) industry are expanding the
3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160 Equipment overview The 3D X-ray inspection system ML-MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laborator
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
