LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Electronics Forum | Fri Apr 18 11:52:25 EDT 2008 | leemeyer
I am looking for some sources for a reuseable thermocouple probe. We do small prototype runs and many times cannot afford to be scrapping boards for profiling. I am looking for a probe that will clamp to a pcb or pcb carrier and allow me to manipulat
Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Industry News | 2019-09-18 16:29:29.0
Nordson DAGE is delighted to announce its success in joining a group of leading UK companies, including Williams Manufacturing Group and Unipart, to advance the UK’s low-carbon automotive capabilities. As part of the UK government’s Industrial Strategy, five projects totaling £33M were awarded through the Advanced Propulsion Centre (APC).
Industry News | 2017-09-28 19:59:35.0
ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer, will present “Reflow, Multiple Thermal Cycles and Cleaning No Clean Solder Paste and the Impact on PCB Reliability" at the Reliability in Electronics Workshop on October 17th in Austin, Texas and October 19th, in Richardson, Texas.
Technical Library | 2009-12-14 20:24:19.0
In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies.
Technical Library | 2022-02-21 19:49:16.0
The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips).
Prima Electronic Services, has chosen to underpin its growth plans by selecting Europlacer’s iineo+ placement platform to address larger and more complex customer boards. The decision to switch to Europlacer is notable as the company has long b
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=2
Bonding The bonding products of Nordson DIMA are Hot Bar Bonding Systems. In this bonding process, flex or other parts are aligned with great accuracy to match the traces on the substrate that need bonding
