Electronics Forum: bonding thermocouple to board for profiling (Page 1 of 4)

thermocouple for profiling

Electronics Forum | Fri Apr 18 11:52:25 EDT 2008 | leemeyer

I am looking for some sources for a reuseable thermocouple probe. We do small prototype runs and many times cannot afford to be scrapping boards for profiling. I am looking for a probe that will clamp to a pcb or pcb carrier and allow me to manipulat

adhesive for thermocouple

Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef

Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 10:27:24 EST 2006 | realchunks

>>> Now you must take into account your total board mass as well. If you have tons of heat sinks, or parts on the other side that can affect your profile, you should have them on the board when profiling. That�s where the "engineering" part in all

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

Criteria for thermocouple wire attachment

Electronics Forum | Wed Jan 10 17:11:53 EST 2007 | mscalzo3

I always try to profile using a fully populated board and soldering the thermocouples. This is the only true way of getting an actual temperature of the joints. But, with that being said, its not always feasible to use this. There have been a coup

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev

Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz

Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu

Looking for trays to lay boards on in reflow oven

Electronics Forum | Mon Jun 10 13:37:03 EDT 2019 | slthomas

How wide is this board? I ask because if it's not terribly wide, you might just be better off attacking the problem with the profile rather than attacking the board conveyor design.

Looking for trays to lay boards on in reflow oven

Electronics Forum | Mon Jun 10 13:47:23 EDT 2019 | don_julio

First thing we did was visit the profile and we have it adjusted as far as we're willing to take it. I'm just going to make a carrier design in cad and have the board house produce some in their thickest substrate to see how it works out. Thanks.

Looking for trays to lay boards on in reflow oven

Electronics Forum | Thu Jun 13 12:44:39 EDT 2019 | dwl

A couple of caveats; The FR4 will degrade with successive reflows and will eventually need to be replaced. Not a big deal for low volume, but something to be aware of. The bigger concern is that a sheet of .125" large enough to position your assembl

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