When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Configuration Software version: 2.8.2 Build: 3298 Fourside cameras oblique view option FX seies (FXSC) Barcode Reader, Bottom-side 2D w/ USB Camera OLS-1 Expansion Modules. Description> Capture on the fly technology 3D
Large format wave solder with huge 24" pcb width capability. Dual wave - smart & chip 3 pre heat secionts Zone 1) Bottom side convection Zone 2) Bottom side convection Zone 3) topside IR, bottomside Cal Rod
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2008-04-07 22:54:27.0
DORSET, UNITED KINGDOM - March 31, 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it has been awarded The 2008 NPI Award in the category of Multifunction Pick-and-Place for its impressive iineo SMT platform. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
SMT heat-resistance type Magazine Rack , PCB Rack Magazine for accommodated PCB Size 535*(50-390)mm Resistant to 120℃ Specification: Surface resistance: 104-106ω Common type and heat-resistance type(120℃ ) are available. Overall Size: 535*460*57
SMT heat-resistance type Magazine Rack , PCB Rack Magazine for accommodated PCB Size 460*(100-330)mm Resistant to 120℃ Specification: Surface resistance: 104-106ω Resistant to 120℃ Overall Size: 460*400*563mm . Can accommodate 50 pieces of PCB.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
http://www.gpd-global.com Don't miss this video, the contour mapping process maps gantry positions to those of a calibrated glass plate for highest level of accuracy when precision fluid dispensing is required. More Info: http://www.gpd-global.com/
http://www.gpd-global.com Watch this amazing NCM5000 Jetting Pump Underfill Process. Underfill 6mm Die, dispense Namic 8410. More Info:http://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php Subscribe Now! https://www.youtub
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
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QFN: Design - Cleaning - Reliability: What you can't see can cause failure! Free Webinar
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SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
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NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
SMTnet Express, July 23, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Reliability Study of Bottom Terminated Components Jennifer Nguyen, Hector Marin, David Geiger, Anwar Mohammed, Murad Kurwa; Flextronics International
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