Industry Directory: bottom board (8)

Electronic Source Company

Electronic Source Company

Industry Directory |

Electronic Source Company (ESC) is an IS9100 Certified Contract Manufacture that provides service for the electronic industries. ESC provides turnkey, quick turns, production runs, and box build service to our customers.

LaserJob

LaserJob

Industry Directory | Manufacturer of Assembly Material / Soldering

Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.

New SMT Equipment: bottom board (2099)

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: bottom board (1169)

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Used SMT Equipment: bottom board (110)

YesTech FX AOI

YesTech FX AOI

Used SMT Equipment | AOI / Automated Optical Inspection

Configuration Software version: 2.8.2 Build: 3298 Fourside cameras oblique view option FX seies (FXSC) Barcode Reader, Bottom-side 2D w/ USB Camera OLS-1 Expansion Modules. Description> Capture on the fly technology 3D

Capital Equipment Exchange

Vitronics Soltec DeltaMAX 6723CC Wave Solder

Vitronics Soltec DeltaMAX 6723CC Wave Solder

Used SMT Equipment | Soldering - Wave

Large format wave solder with huge 24" pcb width capability. Dual wave - smart & chip 3 pre heat secionts Zone 1) Bottom side convection Zone 2) Bottom side convection Zone 3) topside IR, bottomside Cal Rod

Capital Equipment Exchange

Industry News: bottom board (374)

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

Europlacer Wins The �Pick and Place� NPI Award

Industry News | 2008-04-07 22:54:27.0

DORSET, UNITED KINGDOM - March 31, 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it has been awarded The 2008 NPI Award in the category of Multifunction Pick-and-Place for its impressive iineo SMT platform. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

EUROPLACER

Parts & Supplies: bottom board (219)

Surface Mount Techniques SMT Magazine Rack , PCB Rack Magazine for PCB Size 535*(50-390)mm Heat Resistant to 120℃

Surface Mount Techniques SMT Magazine Rack , PCB Rack Magazine for PCB Size 535*(50-390)mm Heat Resistant to 120℃

Parts & Supplies | SMT Equipment

SMT heat-resistance type Magazine Rack , PCB Rack Magazine for accommodated PCB Size 535*(50-390)mm Resistant to 120℃ Specification: Surface resistance: 104-106ω Common type and heat-resistance type(120℃ ) are available. Overall Size: 535*460*57

KingFei SMT Tech

Surface Mount Techniques SMT Magazine Rack , PCB Rack Magazine for PCB Size 460*(100-330)mm Heat Resistant to 120℃

Surface Mount Techniques SMT Magazine Rack , PCB Rack Magazine for PCB Size 460*(100-330)mm Heat Resistant to 120℃

Parts & Supplies | SMT Equipment

SMT heat-resistance type Magazine Rack , PCB Rack Magazine for accommodated PCB Size 460*(100-330)mm Resistant to 120℃ Specification: Surface resistance: 104-106ω Resistant to 120℃ Overall Size: 460*400*563mm . Can accommodate 50 pieces of PCB.

KingFei SMT Tech

Technical Library: bottom board (295)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: bottom board (172)

Contour Mapping for Precision Fluid Dispense

Contour Mapping for Precision Fluid Dispense

Videos

http://www.gpd-global.com Don't miss this video, the contour mapping process maps gantry positions to those of a calibrated glass plate for highest level of accuracy when precision fluid dispensing is required. More Info: http://www.gpd-global.com/

GPD Global

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

http://www.gpd-global.com Watch this amazing NCM5000 Jetting Pump Underfill Process. Underfill 6mm Die, dispense Namic 8410. More Info:http://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php Subscribe Now! https://www.youtub

GPD Global

Training Courses: bottom board (1)

Non-Destructive BGA/Area Array Component Rework - Technical Workshop

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

PACE Worldwide

Events Calendar: bottom board (57)

QFN: Design - Cleaning - Reliability: What you can't see can cause failure! Free Webinar

Events Calendar | Thu Oct 13 11:00:00 EDT 2016 - Thu Oct 13 11:00:00 EDT 2016 | Austin, USA

QFN: Design - Cleaning - Reliability: What you can't see can cause failure! Free Webinar

KYZEN Corporation

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bottom board (2)

Sr. Process Improvement Engineer

Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support

Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

Express Newsletter: bottom board (900)

SMTnet Express - October 23, 2014

SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company

SMTnet Express - July 23, 2015

SMTnet Express, July 23, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Reliability Study of Bottom Terminated Components Jennifer Nguyen, Hector Marin, David Geiger, Anwar Mohammed, Murad Kurwa; Flextronics International

Partner Websites: bottom board (1009)

Assembleon Housing bottom white - 9498 396 02120 - QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/product-item/assembleon-housing-bottom-white-9498-396-02120/

Assembleon Housing bottom white - 9498 396 02120 - QYSMT HOME ABOUT US PRODUCT & SERVICE Panasonic JUKI YAMAHA FUJI SAMSUNG SIEMENS HITACHI

Qinyi Electronics Co.,Ltd

Are You Getting to the Bottom of Your Via?

Nordson ASYMTEK | https://www.nordson.com/en/divisions/march/landing/via-2-5-series

Are You Getting to the Bottom of Your Via? MARCH Products Corporate Global Directory Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series XTRAK System RIE System PD Plasma Deposition Series PROGENY System PCB Systems VIA High

Nordson ASYMTEK


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