High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Nordson ASYMTEK’s advanced multiple camera imaging technology offers high-speed inspection with exceptional defect coverage. With dual sided viewing (top-down and bottom up) cameras and UV lighting the FX-942 ACI inspects conformal coating coverage a
Electronics Forum | Tue Apr 01 16:14:37 EDT 2014 | emeto
Hello, I have newer generation machine(MV-7) and in my software I can open two programs at the same time. After you do that there is a button in the software saying T/B. when you press this button it will run board1(or top side) and right after you
Electronics Forum | Sat Mar 29 10:04:03 EDT 2014 | josse
Hello there everyone! Our company just bought an AOI Inspection Machine, and that is the Mirtec MV-2HTL 1.3 megapixel, software rev 4. I am trying to create a program that runs the top side first and then asks to run the bottom side consecutively. I
Configuration Software version: 2.8.2 Build: 3298 Fourside cameras oblique view option FX seies (FXSC) Barcode Reader, Bottom-side 2D w/ USB Camera OLS-1 Expansion Modules. Description> Capture on the fly technology 3D
Options: (1) IR-preheating, bottom side segmented pin/chain and roller conveyor for versaflow with double soldering module programmable conveyor width adjust (4) convection preheating top side automatic solder wire feeder, solder
Industry News | 2008-03-04 12:05:25.0
APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.
Industry News | 2008-09-14 15:09:42.0
APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
JUKI Genuine spare parts 40047573 OCC CAMERA XC-HR50 for KE3010 3020 FX-3 JX-100 JX-200 smt machine Specifications: Brand Name JUKI OCC CAMERA Part number 40047573 Model XC-HR50 Ensure Test in machine confirmation Guarantee 1 month usage
SMT PICK AND PLACE MACHINE SPARE PARTS JUKI FX-3 FX-3R MOTOR 103F7852-8247 JUKI Parts Specifications: Brand Name JUKI MOTOR Part Number Model Number 103F7852-8247 Ensure Tested buy juki Guarantee 1 month usage for machine JUKI FX-3 FX-
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-04-23 18:48:18.0
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940U
SMTnet Express, May 24, 2018, Subscribers: 31,054, Companies: 10,942, Users: 24,751 Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units Udo Welzel, Marco Braun
+GDAz 550BTL CE AOI Machine InLine – Top Bottom Inline 550 Chassis – Dual Gxx Head In-line 18-Camera AOI for up to 550x550mm 5kg PCBs
MV2C/F/B Cutter Blade Carbide (Bottom) 800-538-0426 Welcome, Guest • Login View Cart Home About Us News Contact Us My Account Cart ( 0