Industry Directory | Manufacturer
Nitrogen Hot Air Circulation Reflow, Screen Printer, Wave Soldering, Double Unloader, Inverter Machine, 90° PCB Transfer Buffer Loader & Unloader
New Equipment | Soldering - Other
High specification, bench top rotary table soldering machine A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PL
New Equipment | Soldering - Other
High specification, bench top rotary table soldering machine A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PL
Electronics Forum | Sat Sep 01 06:09:25 EDT 2001 | opor_a
Hi guy Please help advise me the impact of using Nitrogen to solder bridging defect. I heard somebody said that using nitrogen can effect the bridging problem by higher surface tension in case inaccurate printing . Is it true? Thanks.
Electronics Forum | Thu Sep 06 11:17:13 EDT 2001 | Steve
I may be wrong, but I'm thinking that nitrogen has less effect on solder bridging as does the amount of solder that is present. Nitrogen allows better wetting becasue there are no oxidation effects. If you have solder bridging problems, look at the
Used SMT Equipment | Soldering - Wave
Electrovert Wave Soldering Machine Solder Pot Full of AIM 6367 Model Number: Electra Internal Foan Fluxer 21 inch Entrance Rail Extension Upgrade Dual Wave Rotary Speed Adjustable Contour Plus Nitrogen Rotary Chip Wav
Industry News | 2020-04-14 22:14:18.0
ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.
Industry News | 2018-10-18 08:02:28.0
What are the advantages of use nitrogen process for SMT reflow oven?
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Bridging at Reflow, What is the Cause and Can it be Eliminated? SMTnet Express April 12, 2012, Subscribers: 25060, Members: Companies: 8851, Users: 32937 Bridging at Reflow, What is the Cause and Can it be Eliminated? by: Robert Dervaes, V
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/debridging-knife
- Available on all Novo ® 102, 103, Cerno ® 102IL, 103IL, 105IL and Integra ® 103ILD soldering machines Overview The Nitrogen De-Bridging Knife is designed to ensure bridge free soldering when selective soldering fine-pitch devices such as micro connectors or ribbon connectors
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between
